ISSN:
1573-482X
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract The improvement of the (1 1 1) texture and microstructure of Cu films on TiN/Si and TiN/SiO2 substrates by pulsed KrF laser annealing as a function of the laser energy density, the deposition method of Cu films, and the orientation of TiN substrates is studied. Upon annealing at an energy density below 1.0 J cm−2 the (1 1 1) texture of the evaporated Cu films increases with the energy density, whereas for the sputtered Cu films the (2 0 0) texture is promoted. The higher oxygen concentration in the sputtered Cu films may be responsible for the degradation of the Cu(1 1 1) texture. The enhancement of the Cu(1 1 1) texture is more evident for (1 1 1)-oriented TiN substrates than for (2 0 0)-oriented TiN substrates. The present study shows that pulsed laser annealing is superior to vacuum annealing in improving the (1 1 1) texture and microstructure of Cu films via the melt/solidification process.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1023/A:1008918508083
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