ISSN:
0021-8995
Keywords:
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Copolyimides with siloxane moieties in the main chain were synthesized by solution polycondensation of 1,3-bis(3-aminopropyl) tetramethyldisiloxane (APMS), oxydianiline (ODA) with 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA) in N-methyl-2-pyrrolidone (NMP). The adhesion properties between copolyimides and silicon wafer were improved significantly with incorporation of siloxane moiety into polymer chain.Photosensitive copolyimide precursor was obtained by further reaction of silicon-containing copolyamic acid with 2-isocyanatoethyl methacrylate (IEM). The insoluble fraction of photosensitive copolyimide precursor reached 90% after 10 min of irradiation with UV light. In comparison, the thermal imidization of irradiated photosensitive copolyimide precursor was more difficult than that of silicon-containing copolyamic acid. A longer heating time or higher imidization temperature was required.
Additional Material:
9 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/app.1990.070410331
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