ISSN:
1089-7623
Source:
AIP Digital Archive
Topics:
Physics
,
Electrical Engineering, Measurement and Control Technology
Notes:
An ultrahigh vacuum sputtering system with offset incidence magnetron sources has been designed and developed to deposit thin films and multilayers with excellent film thickness uniformity, precise control over layer thickness, and surface and interface roughness. The unique feature of the system is that the sputtering guns are aligned at 35° oblique incidence onto a rotating substrate with a 60 mm offset from the substrate center, which make full use of the best linearity of the plasma flux at the substrate, and therefore, deposit extremely uniform thin films. Other features include, computer-controlled deposition process, capability of heating the substrate to 1100 °C, and in situ monitoring of thin-film quality with reflection high-energy electron diffraction. The performance of the sputtering system is demonstrated, and a characterization of multilayers deposited by the system using a grazing incidence x-ray reflectivity and high resolution electron microscope is also presented. © 1999 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.1150080
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