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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 1732-1736 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In this work, the refractive index profiles of SiO2/Si3N4/SiO2/silicon (ONO) structures were measured and analyzed by ellipsometry. The ONO structures were obtained by oxidizing the Si3N4/SiO2/silicon structure in a wet O2 ambient at the temperature range of 900–1050 °C for different lengths of time. It was found that for a nitride film thickness less than 250 A(ring), oxygen not only oxidized the surface, but diffused through the nitride and oxidized the inner surface of the nitride. This result was confirmed by the Auger analysis. The kinetics of the wet O2 oxidation of nitride at the above temperature range was linear for an oxidation time of 30–120 min. The activation energy was 2.24 eV.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 6108-6112 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A new ohmic contact system, Ge/Pt/Ge/Pt/n-InP, was studied systematically by measuring its specific contact resistance and by using Auger electron spectroscopy, x-ray-diffraction analysis, Rutherford backscattering spectroscopy, and scanning electron microscopy. It was found that the system has a wide temperature range for annealing, i.e., 450–550 °C, to achieve the specific contact resistance of the order of 1.0×10−5 Ω cm2. It can achieve a low specific contact resistance of 7.71×10−6 Ω cm2 when it is subjected to rapid thermal annealing at 500 °C for 30 s. The whole process is a solid phase reaction so that a smooth surface morphology is obtained. The ohmicity is due to the heavy doping of Ge in the regrown InP film. The contact system exhibits good thermal stability, being able to maintain a low specific contact resistance of 9.15×10−6 Ω cm2 for 20 h, 400 °C aging, and 2.77×10−5 Ω cm2 for 80 h aging. © 1995 American Institute of Physics.
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 9200-9205 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: This work studied the AuGe to n-InP/ohmic contact system with the addition of Pt. It studied two contact schemes, i.e., Au/Ge/Pt/n-InP and Au/Pt/Au/Ge/n-InP. The specific contact resistances, the thermal stability, as well as the microstructure of the system, were systematically studied with the aid of scanning electron microscopy, Auger electron spectroscopy, Rutherford backscattering analysis, and x-ray diffraction. The processing condition to achieve the optimum contact resistance was also sought and it was found that a specific contact resistance of 2.15×10−6 Ω cm2 could be obtained if the Au/Ge/Pt/n-InP contact system was rapid thermal annealed at 550 °C for 30 s. The system was also found to be able to achieve low specific contact resistances for a wide range of anneal temperature from 400 to 550 °C. It was found that the Pt existence in-between AuGe and InP improved the surface morphology, the contact interface uniformity, and the thermal stability. The system could withstand a thermal aging at 400 °C for 80 h with only a minimal increase on the specific contact resistance. © 1996 American Institute of Physics.
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 291-294 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A high performance double metal structure, Pt/Al/n-InP diode is discussed. The diode exhibits an effective barrier height of 0.74 eV, forward characteristics with an ideality factor n=1.11 over five decades, and a reverse leakage current of 1.34×10−4 A/cm2 at −3 V. A detailed study of the electrical characteristics and secondary ion mass spectroscopy analysis of the sample suggest that the high barrier height is due to formation of an interfacial layer at the contact interface. The diode exhibits good thermal stability, maintaining a barrier height of 0.70 eV after annealing at 300 °C for 10 h. © 1995 American Institute of Physics.
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  • 5
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 63 (1993), S. 24-26 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: This letter reports a stacked nitride/microcrystalline-silicon/oxide/silicon structure, which exhibits a higher electron injection efficiency, a less electron trapping rate, and a larger charge to breakdown than the normal oxide. Besides, the room-temperature resonant tunneling effect is also observed for this structure.
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  • 6
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: This letter presents an ultrathin textured polycrystalline oxide (polyoxide) (≤100 A(ring)) prepared by thermal oxidation of thin polycrystalline silicon (polysilicon) film on n+ polysilicon. The presented textured polyoxide exhibits a much higher electron injection efficiency, a much smaller electron trapping rate, and a much larger charge to breakdown than the normal polyoxide. The value of Qbd of the textured polyoxide could be more than 3000 C/cm2 even under 100 mA/cm2 stressing.
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  • 7
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 67 (1995), S. 3477-3479 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The radiation effect on the n-channel polycrystalline silicon (polysilicon) thin-film transistors has been investigated. It is found that for an unhydrogenated device, the irradiation of Co60 with a total dose of 1 Mrads caused a negative threshold-voltage (Vth) shift and a slight subthreshold-swing (S) degradation, while for a hydrogenated n-channel device, the same irradiation results in a positive Vth shift and a serious S degradation. It is also found that the radiation hardness of the hydrogenated devices can be improved somewhat by a simple irradiation-then-hydrogenation treatment. © 1995 American Institute of Physics.
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  • 8
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 66 (1995), S. 3013-3014 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: This letter studies the hydrogen plasma effects on the resistivity, effective free carrier concentration, and mobility of As+- and BF+2-doped polycrystalline silicon (polysilicon) thin films of various thicknesses. It is found that the resistivity increases while the effective free carrier concentration decreases after the plasma treatment as the thickness of the polysilicon film decreases. The mobility typically tends to decrease for the thicker ((approximately-greater-than)60 nm) polysilicon film, but to increase for the thinner (〈60 nm) polysilicon film. © 1995 American Institute of Physics.
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  • 9
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 12 (1993), S. 721-723 
    ISSN: 1573-4811
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
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  • 10
    Electronic Resource
    Electronic Resource
    Springer
    Journal of electronic testing 2 (1991), S. 395-397 
    ISSN: 1573-0727
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Abstract It is shown that for a two-level irredundant single/multiple output combinational circuit, the checkpoints consist of all primary inputs without fanout, and all fanout branches in the circuit. Any test set that detects all single stuck faults on these checkpoints will also detect all single stuck faults in the circuit.
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