Electronic Resource
s.l. ; Stafa-Zurich, Switzerland
Solid state phenomena
Vol. 103-104 (Apr. 2005), p. 217-220
ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
Cu contamination control is critically important in Cu interconnect device manufacturing lines. The frontside gas protected spin cleaning enables the effective removal of the Cu contaminant from the backside and bevel of a wafer. A small area on the bevel was measured for cleaning efficiency using SOR (Synchrotron Orbital Radiation) X-ray fluorescence. The atomic level Cu removal was detectedon the bevel surface with the barrier metal Ta existing wafers. The high energy SOR X-ray analysis makes it possible to measure the Cu contamination, where conventional methods do not work
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/21/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.103-104.217.pdf
Permalink
|
Location |
Call Number |
Expected |
Availability |