ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The focus of this study was on discussing the novel reflow method ISHR (Inductionspontaneous heat reflow) used for high-density area array packaging and assembly. Multi-layerunder bump metallization (UBM) and Sn3.5Ag lead-free solder ball were laid in the high frequencyelectromagnetic field. Because of the induction heating, solder balls melted and spread onto theUBM to form solder bumps. The solder bumps could be formed within 2 seconds through thismethod; meanwhile, the infrared temperature measurement results showed that the rosin substratetemperature was lower. The shear test indicated that the solder bumps made by ISHR can satisfy themechanical requirement. Finally, the feasibility experiment was performed to demonstrate theapplication feasibility of this ISHR technology. Through all these experiments, conclusion can bemade that the ISHR as a novel reflow method can be applied in microelectronics packaging
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.580-582.167.pdf
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