ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In an optical module with high density and small size, it is important to maintain theoperating temperature by adequate heat dissipation. The thermal simulation of an optical module forcommunication has been performed to reduce the operating temperature. To improve the behaviorof heat dissipation, we have simulated heat path and heat resistance using commercial code,COMSOL. We have chosen simulation parameters, which include thickness, thermal conductivity,interface area and surface roughness of heat sink and submount as an element of heat resistance. Toreduce heat resistance, it was desirable to use the material of higher thermal conductivity, singlecrystalline silver, and to control the surface roughness of the interfaces. We could lower theoperating temperature of an optical module about 18 degrees by controlling the above parameters
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.580-582.163.pdf
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