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  • 1
    Publication Date: 2019-06-28
    Description: Thin films of niobium nitride with high superconducting temperature (T sub c) of 15.7 K are deposited on substrates held at room temperature (approx 90 C) by heat sink throughout the sputtering process. Films deposited at P sub Ar 12.9 + or - 0.2 mTorr exhibit higher T sub c with increasing P sub N2,I with the highest T sub c achieved at P sub n2,I= 3.7 + or - 0.2 mTorr and total sputtering pressure P sub tot = 16.6 + or - 0.4. Further increase of N2 injection starts decreasing T sub c.
    Keywords: SOLID-STATE PHYSICS
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  • 2
    Publication Date: 2019-07-12
    Description: Ballast resistors deposited on top of circuit structure. Cascadable, programmable binary connection matrix fabricated in VLSI form as basic building block for assembly of like units into content-addressable electronic memory matrices operating somewhat like networks of neurons. Connections formed during storage of data, and data recalled from memory by prompting matrix with approximate or partly erroneous signals. Redundancy in pattern of connections causes matrix to respond with correct stored data.
    Keywords: ELECTRONIC COMPONENTS AND CIRCUITS
    Type: NPO-17059 , NASA Tech Briefs (ISSN 0145-319X); 12; 1; P. 38
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  • 3
    Publication Date: 2019-08-15
    Description: An electrode having increased output with slower degradation is formed of a film applied to a beta-alumina solid electrolyte (BASE). The film comprises a refractory first metal M.sup.1 such as a platinum group metal, suitably platinum or rhodium, capable of forming a liquid or a strong surface adsorption phase with sodium at the operating temperature of an alkali metal thermoelectric converter (AMTEC) and a second refractory metal insoluble in sodium or the NaM.sup.1 liquid phase such as a Group IVB, VB or VIB metal, suitably tungsten, molybdenum, tantalum or niobium. The liquid phase or surface film provides fast transport through the electrode while the insoluble refractory metal provides a structural matrix for the electrode during operation. A trilayer structure that is stable and not subject to deadhesion comprises a first, thin layer of tungsten, an intermediate co-deposited layer of tungsten-platinum and a thin surface layer of platinum.
    Keywords: Electronics and Electrical Engineering
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