ISSN:
0021-8995
Keywords:
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
An apparatus for measuring the peel adhesion behavior is developed on the basis of the circular motion of the compound pendulum. The peel force versus peel rate characteristics at the increasing and decreasing rates of peeling can be measured in a half cycle of rotation of the pendulum. A personal computer plays the important roles of operating the automated apparatus and processing data in real time. To test practical performance of the apparatus, the relation between peel force and rate of peeling was investigated for various pressuresensitive adhesive (PSA) tapes over a wide peel rate range. The respective curves in peel force versus peel rate in the increasing and decreasing rate processes are consistent with each other in the rate regions where cohesive or interfacial failures occur; while in the transition region between their failures, it appears that a peel hysteresis exists. Furthermore, the conventional testing under constant rate was repeated, and good agreement with the results from the present apparatus was obtained.
Additional Material:
8 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/app.1992.070460321
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