ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
For flip-chip process of RF system-on-packages(SOP), double bump bonding processeswere investigated. Sn-Ag and Sn solder joints were formed by the reflowed double bumping process,and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. Theheight-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and thenon-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sn solderjoints was about 13m/ which was much lower than 24~33m/ of the non-reflowed Sn/In/Sn bump joints.The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than thenon-reflowed double bump bonding
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.124-126.25.pdf
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