Publication Date:
2011-10-12
Description:
The fabrication of a three-dimensionally structured metal oxide on various substrates mediated with self-assemble monolayer (SAM) Au -precoated substrates, such as Si wafer, non-planar glass, and flexible plastic, is important for a number of practical applications in electronics, photonics, and biotechnology. In this report, we describe the use of transfer printing for forming three-dimensionally structured TiO 2 thin films with feature sizes of 10 μm in the diameter and 3 μm in height over areas of several square millimeters by direct patterning onto Si surfaces. This process is mediated by the presence of a 3-mercaptopropyltrimethoxysilane monolayer that guides the transfer of three-dimensionally structured TiO 2 thin films from the low-energy surfaces of the mold to a Si substrate via surface forces.
Print ISSN:
0002-7820
Electronic ISSN:
1551-2916
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Permalink
