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  • 1
    Electronic Resource
    Electronic Resource
    Dual analysis for heat conduction problems by finite elements (1972)
    Chichester [u.a.] : Wiley-Blackwell
    International Journal for Numerical Methods in Engineering 5 (1972), S. 65-82 
    Details
    ISSN: 0029-5981
    Keywords: Engineering ; Engineering General
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mathematics , Technology
    Notes: An alternative approach to the usual finite element treatment of steady-state temperature problems is presented, using approximations for the field of the dual variables.The appropriate extremum principle is established and its minimization is discussed in connection with a plane triangular finite element process. Original heat flow elements are derived: in conjunction with temperature elements, they enable dual analysis of a given structure and an important estimate of the convergence to the true solution by upper and lower bounds to the dissipation function, as illustrated by means of several examples.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/nme.1620050107
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