ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Many technologies, such as Radio Frequency Identification (RFID), have been developedto keep pace with rapid changes in society. Additionally, an RFID tag can be integrated with asensor or actuator (a smart RFID), they can comprise a sensitive wireless network. The potentialand utility of smart RFID techniques have increased dramatically. However, based on thedistinctive characteristics of RFID and sensors/actuators, they cannot be combined simultaneouslyusing commercial RFID techniques and materials such as poly phenylene sulfide (PPS).Conversely, smart RFID systems will be exposed to harsh environments, including temperaturevariations, salt corrosion, and violent impact. The current polymeric RFID packaging techniquecannot withstand severe environmental conditions for a long period. This study presents a novelintegrated packaging technique for sensors and RFID that is fully compatible with thecomplementary metal-oxide-semiconductor (CMOS) processes to identify the limitations oftraditional RFID packaging methods. After several tests in harsh environments, such as strength,corrosion resistance, thermal stress, and simulated washing, the RFID and sensor operatednormally. Therefore, the novel encapsulation process for RFID integrated with a sensor overcomesthe bottleneck of conventional RFID packaging techniques. The potential of this novel technique issignificant and provides a new approach as it achieves high performance and at a low cost.Furthermore, the proposed new technique should prove very useful in applications as smart RFIDareas
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/56/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.364-366.419.pdf
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