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  • 1
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    Unknown
    Monitoring cure of composite resins using frequency dependent electromagnetic sensing techniques (1988)
    In:  Other Sources
    Details
    Publication Date: 2019-07-27
    Description: A nondestructive in situ measurement technique has been developed for monitoring and measuring the cure processing properties of composite resins. Frequency dependent electromagnetic sensors (FDEMS) were used to directly measure resin viscosity during cure. The effects of the cure cycle and resin aging on the viscosity during cure were investigated using the sensor. Viscosity measurements obtained using the sensor are compared with the viscosities calculated by the Loos-Springer cure process model. Good overall agreement was obtained except for the aged resin samples.
    Keywords: QUALITY ASSURANCE AND RELIABILITY
    Type: Technical Conference of the American Society for Composites; Sept. 25-29, 1988; Seattle, WA; United States
    Format: text
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    NASA TECHNICAL REPORTS
  • 2
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    Monitoring processing properties of high performance thermoplastics using frequency dependent electromagnetic sensing (1987)
    In:  Other Sources
    Details
    Publication Date: 2019-07-13
    Description: An in situ NDE dielectric impedance measurement method has been developed for ascertaining the cure processing properties of high temperature advanced thermoplastic and thermosetting resins, using continuous frequency-dependent measurements and analyses of complex permittivity over 9 orders of magnitude and 6 decades of frequency at temperatures up to 400 C. Both ionic and Debye-like dipolar relaxation processes are monitored. Attention is given to LARC-TPI, PEEK, and poly(arylene ether) resins' viscosity, glass transition temperature, recrystallization, and residual solvent content and evolution properties.
    Keywords: COMPOSITE MATERIALS
    Type: Advanced materials technology ''87; Apr 06, 1987 - Apr 09, 1987; Anaheim, CA; United States
    Format: text
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    NASA TECHNICAL REPORTS
  • 3
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    Dynamic dielectric analysis for nondestructive cure monitoring and process control (1986)
    In:  Other Sources
    Details
    Publication Date: 2019-07-13
    Description: Dynamic dielectric analysis (DDA) is an effective in situ NDE method that can monitor the reaction status in thermosets and the phase changes in thermoplastics, including slow reactions occuring late in the cure cycle and recrystallization during annealing. The effects of moisture and resin history on reaction rate can also be determined, as can ionic and dipolar contributions. The ionic mobility parameter is noted to be an excellent monitor of viscosity above the glass transition temperature. The ability of DDA to monitor cure rate variations in a thick section during autoclaving has been demonstrated.
    Keywords: INSTRUMENTATION AND PHOTOGRAPHY
    Type: Advanced composites: The latest developments; Nov 18, 1986 - Nov 20, 1986; Dearborn, MI; United States
    Format: text
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    NASA TECHNICAL REPORTS
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