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  • 1
    Electronic Resource
    Electronic Resource
    Aminosiloxane-modified epoxy resins as microelectronic encapsulants (1995)
    Weinheim : Wiley-Blackwell
    Angewandte Makromolekulare Chemie 224 (1995), S. 21-32 
    Details
    ISSN: 0003-3146
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Description / Table of Contents: Für die Anwendung als Verkapselungsmaterial für elektronische Bauteile wurde ein epoxidiertes Kresol-Formaldehyd-Novolakharz zur Verbesserung der Festigkeit mit Amin-terminierten Poly(dimethylsiloxan)en (ATPDMS) modifiziert und mit einem Phenol-Formaldehyd-Novolakharz ausgehärtet. Sowohl der Einfluß des Molekulargewichts der ATPDMS auf die Separation der Elastomerphase von der Epoxidmatrix als auch mechanische und dynamisch viskoelastische Eigenschaften der mit Siloxan modifizierten Epoxidnetzwerke wurden untersucht. Die dispergierten Silikonkautschuke verbessern die Festigkeit der ausgehärteten Epoxidharze durch Verringerung des thermischen Ausdehnungskoeffizienten und des Biegemoduls, während die Glasübergangstemperatur kaum abgesenkt wird. Mit den Silikon-modifizierten Epoxidformmassen verkapselte elektronische Bauteile zeigen in der thermischen Schockprüfung ein ausgezeichnetes Verhalten, was sich in einer erhöhten Lebensdauer der Bauteile niederschlägt.
    Notes: Amine-terminated poly(dimethylsiloxanes) (ATPDMS) were used to improve the toughness of a cresol-formaldehyde novolac epoxy resin cured with a phenolic novolac resin for electronic encapsulation application. The effect of molecular weight of amine-terminated polysiloxanes on the phase separation of the resultant elastomers from epoxy matrix were investigated. Mechanical and dynamic viscoelastic properties of siloxane-modified epoxy networks were also studied. The dispersed silicone rubbers effectively improve the toughness of cured epoxy resins by reducing the coefficient of thermal expansion and flexural modulus, while the glass transition temperature was hardly depressed. Electronic devices encapsulated with the dispersed silicone rubber-modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and have resulted in an extended device use life.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/apmc.1995.052240103
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  • 2
    Electronic Resource
    Electronic Resource
    Toughening of epoxy resins by modification with dispersed acrylate rubber for electronic packaging (1993)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 50 (1993), S. 477-483 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Dispersed acrylate rubbers were used to improve the toughness of cresol-formaldehyde Novolac epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The effect of the alkyl group of the acrylate monomer on the phase separation of resultant elastomers from epoxy resin was investigated. The dispersed acrylate rubbers effectively improve the toughness of cured epoxy resins by reducing the coefficient of thermal expansion (CTE) and flexural modulus, while the glass transition temperature (Tg) was hardly depressed. Electronic devices encapsulated with the dispersed acrylate rubber-modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and have resulted in an extended device use life. © 1993 John Wiley & Sons, Inc.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/app.1993.070500311
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  • 3
    Electronic Resource
    Electronic Resource
    Modification of epoxy resins by hydrosilation for electronic encapsulation application (1994)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 54 (1994), S. 13-23 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Hydride terminated polydimethyl siloxanes were used to reduce the stress of cresol-form-aldehyde novolac epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The effects of the structure and molecular weight of the hydride terminated polydimethyl siloxane in reducing the stress of encapsulant were investigated. The mechanical and dynamic viscoelastic properties and morphologies of rubber modified epoxy networks were also studied. A “sea-island” structure (“islands” of silicone rubber dispersed in the “sea” of an epoxy resin) was observed via SEM. The dispersed silicone rubbers effectively reduce the stress of cured epoxy resins by reducing flexural modulus and the coefficient of thermal expansion, while the glass-transition temperature was hardly depressed. Electronic devices encapsulated with the dispersed silicone rubber modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and have resulted in an extended use life for the devices. © 1994 John Wiley & Sons, Inc.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/app.1994.070540102
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  • 4
    Electronic Resource
    Electronic Resource
    Low-stress encapsulants by vinylsiloxane modification (1994)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 51 (1994), S. 2047-2055 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Dispersed silicone rubbers were used to reduce the stress of cresol-formaldehyde novolac epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The effects of structure, molecular weight, and contents of the vinylsiloxane oligomer on reducing the stress of the encapsulant were investigated. Morphology and dynamic mechanical behavior of rubber-modified epoxy resins were also studied. The dispersed silicone rubbers effectively reduce the stress of cured epoxy resins by reducing flexural modulus and the coefficient of thermal expansion (CTE), whereas the glass transition temperature (Tg) was hardly depressed. Electronic devices encapsulated with the dispersed silicone rubber modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and have resulted in an extended device use life. © 1994 John Wiley & Sons, Inc.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/app.1994.070511210
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