ISSN:
1089-7550
Source:
AIP Digital Archive
Topics:
Physics
Notes:
Aluminum nitride (AlN) has been used as an encapsulant for annealing nitrogen (N), arsenic (As), antimony (Sb), aluminum (Al), and boron (B) ion-implanted 6H-SiC. Atomic force microscopy has revealed that the AlN encapsulant prevents the formation of long grooves on the SiC surface that are observed if the AlN encapsulant is not used, for annealing cycles up to 1600 °C for 15 min. Secondary ion mass spectrometry measurements indicated that the AlN encapsulant is effective in preserving the As and Sb implants, but could not stop the loss of the B implants. Electrical characterization reveals activation of N, As, Sb, and Al implants when annealed with an AlN encapsulant comparable to the best activation achieved without AlN. © 1999 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.370798
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