Publication Date:
2019-07-13
Description:
The processing and performance characteristics of a soluble, thermoplastic polyquinoline suggest its utility in a variety of high performance applications. The polymer is characterized by excellent thermal and oxidative stability, very low moisture absorption, good mechanical properties, very low dielectric constant, and an unusually low thermal expansion coefficient. This polymer, designated PQ-100 (TM), can be cast into strong, transparent, free standing films from common solvents. Coatings of variable thickness can be spin-coated on to silicon and other surfaces. After processing into films, PQ-100 (TM) can be rendered insoluble in a wide range of solvents using a proprietary process. The low CTE contributes to very low residual stress when the polymer is spin-coated onto silicon wafers. PQ-100 (TM) is currently under evaluation for use as an interlayer dielectric substrate in high-density interconnect applications, including multichip modules. Many of the characteristics of the polymer also suggest its utility as a high-performance film and as a matrix resin for specialty composite applications.
Keywords:
NONMETALLIC MATERIALS
Type:
International SAMPE Symposium and Exhibition; Apr 15, 1991 - Apr 18, 1991; San Diego, CA; United States
Format:
text
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