ISSN:
1572-8838
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
,
Electrical Engineering, Measurement and Control Technology
Notes:
Abstract The effect of low concentrations (0–100 mg 1−1) of F, Cl, Br, I, As, Sb, Bi, Ni, Zn, Fe, Ag, Te, Se, Pb, and S on the internal stress of bright copper electrodeposits was studied. The following solution containing 30 mg 1−1 of thiourea as a brightening additive was used as the electrolyte: CuSO4·5H2O (225 g l−1), H2SO4 (60g l−1). It is shown that the internal stress of copper electrodeposits can be considerably reduced by addition of Se(IV), Cl, Br, or I to the above electrolyte.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00617557
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