Electronic Resource
Woodbury, NY
:
American Institute of Physics (AIP)
Applied Physics Letters
54 (1989), S. 2074-2075
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
A Nd:YAG laser was used to reflow Cu/Pb-Sn solder joints. The joints were reflowed with 60 W, 1 s laser pulse. The resulting intermetallic microstructure was examined with scanning electron microscopy, energy dispersive x-ray analysis, and x-ray diffraction. In addition to the intermetallic layer expected to form at the solder-base metal interface, an intermetallic precipitate was found to form in the bulk solder. X-ray diffraction data established the identity of the intermetallic as η-Cu6Sn5.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.101563
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