ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Effects of isothermal aging on the microstructure and tensile behavior ofSn-3.0Ag-0.5Cu-0.2Co (SAC305-0.2Co) solder was explored, and compared with the standardSn-3.0Ag-0.5Cu (SAC305) solder. The addition of Co resulted in the formation of CoSn2 phase inSAC305-0.2Co solder matrix. The isothermal aging treatment induced microstructural coarseningfor both solders. With aging, the eutectic network has been translated into block or granular shapeparticles. Meanwhile, the outline of the primary Sn phase became less distinct. The tensile testresults indicated, under as cast condition, the Co had little effect on the ultimate tensile strength(UTS) of SAC305-0.2Co solder, whereas it suppressed the ductility. After aging, the UTS ofSAC305 was obviously decreased, whereas the elongation hardly changed. For the SAC305-0.2Co,the tensile behavior showed two trends: one was the decrease of the UTS, which was similar to thatof SAC305; the other was the notable increase of elongation. The examination of the fracturesurfaces indicated that isothermal aging could alter the fracture pattern of SAC305-0.2Co solderfrom brittle to ductile
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.580-582.239.pdf
Permalink