ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Interfacial delamination is a recognized failure mode in Integrated circuits (ICs). A majorcause for this failure is the mismatch of Thermal Expansion Coefficients, Young’s modulus, andPoisson’s ratios of the package materials. Here, the influence of delamination between epoxy anddielectric layers on pattern shift and passivation cracking in IC package under aeronauticalconditions, mainly temperature and load cycles, is studied by maximum plastic strain and maximumprincipal stresses theory using a certain 2D FEM model with different delamination length“L_c.right”. Delaminations are easy to introduce more dangerous impact to the package, becausethe IC microstructures endure serious thermo-mechanical loading under aeronautical workingconditions. The method can be used to find the dangerous designed structure schedules and willprovide a basis for selecting passivation materials of aeronautical IC packages
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.575-578.919.pdf
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