ALBERT

Description: Nicotine consumption is considered a major health problem, where many of those who wish to quit smoking relapse. The problem is that overtime smoking as behaviour is changing into a habit, in which it is connected to internal (e.g., nicotine level, craving) and external (action, time, location) triggers. Smoking cessation apps have proved their efficiency to support smoking who wish to quit smoking. However, still, these applications suffer from several drawbacks, where they are highly relying on the user to initiate the intervention by submitting the factor the causes the urge to smoke. This research describes the creation of a combined Control Theory and deep learning model that can learn the smoker’s daily routine and predict smoking events. The model’s structure combines a Control Theory model of smoking with a 1D-CNN classifier to adapt to individual differences between smokers and predict smoking events based on motion and geolocation values collected using a mobile device. Data were collected from 5 participants in the UK, and analysed and tested on 3 different machine learning model (SVM, Decision tree, and 1D-CNN), 1D-CNN has proved it’s efficiency over the three methods with average overall accuracy 86.6%. The average MSE of forecasting the nicotine level was (0.04) in the weekdays, and (0.03) in the weekends. The model has proved its ability to predict the smoking event accurately when the participant is well engaged with the app.

Description: We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Description: Thermal land imaging (imaging at ~8-14 micron optical wavelength) is an essential tool for understanding and managing terrestrial freshwater resources. Current thermal imaging instruments employ low temperature detectors, which require cryocoolers. Consequently, cost-saving reductions in size, weight, and power can be achieved by employing uncooled detectors. One uncooled detector concept, which NASA is pursuing, is a thermopile detector with sub-micron thick doped-Si thermoelectric materials. In order to characterize the thermoelectric properties of the doped silicon, we designed and optimized a novel apparatus. This simple apparatus measures the Seebeck coefficient with thermally isolated stages and LABVIEW automation. We optimized thermal stability using PID tuning and optimized the thermal contact between the thin film samples and stages using electrically conductive springs. Utilizing our apparatus, we measured the Seebeck coefficient of 0.45 micron thick phosphorus-doped single crystal Si samples bonded to alumina substrates. Using these Seebeck coefficient measurements and four-wire electrical resistivity measurements, we determined the relationship between the thermoelectric figure of merit and dopant concentration. These characterization results for doped-Si will guide our thermopile detector design to provide an optimal and competitive detector alternative for future thermal imaging instruments.

Description: The High Resolution Mid-Infrared Spectrometer (HIRMES) instrument will fly onboard NASA's airborne Stratospheric Observatory for Infrared Astronomy (SOFIA) in 2019. HIRMES will provide astronomers with a unique observing window (25 122 m) for exploring the evolution of protoplanetary disks into young solar systems, and the composition of our Solar System. There are two focal plane detector arrays for the instrument: a high-resolution (/ = 100,000) 8x16 detector array with a target noise-equivalent power, NEP 3x10-18 W/Hz; and a low-resolution (/ = 2,000 19,000) 16x64 detector array with a target NEP 2x10-17 W/Hz. The detectors for both of these arrays are superconducting Mo/Au bilayer transition edge sensor (TES) bolometers on thin suspended single-crystal silicon membranes. Here we present our characterization results for the detectors in both arrays, including measurements of thermal conductance with comparison to phonon transport models, saturation power, noise, and array uniformity.

Description: The high-resolution mid-infrared spectrometer (HIRMES) under development for SOFIA (Stratospheric Observatory for Infrared Astronomy) is an instrument operating in the 25-122 m spectral range with a spectral resolution R= / ~100,000 and has two absorber-coupled transition edge sensor (TES) bolometric detector focal planes. We have developed novel NbTiN low stress absorber coatings which have the required optical impedance across the HIRMES operating band. The low intrinsic stress of these coatings allow for a peak-to-valley corrugation amplitude 〈 5 m of the 450 nm thick, 1.4 mm x 1.7 mm detector pixels. Furthermore, these coatings have a superconducting transition temperature ~ 10 K, which allows them to simultaneously serve as an absorber in the desired signal band and a rejection filter at long wavelengths. This attribute makes them especially attractive for ultrasensitive absorber-coupled bolometric detector applications, because it helps in controlling the optical loading from out-of band radiation. We also discuss a novel method for integrating a wedged reflective absorber-termination to the detector array.

Description: We are developing the VAPoR (Volatile Analysis by Pyrolysis of Regolith) instrument towards studying soil composition, volatiles, and trapped noble gases in the polar regions of the Moon. VAPOR will ingest a soil sample and conduct analysis by pyrolysis and time-of-flight mass spectrometry (ToF-MS). Here, we describe miniaturization efforts within this development, including a carbon nanotube (CNT) field emission electron gun that is under consideration for use as the electron impact ionization source for the ToF-MS.

Description: We have developed a new microshutter array (MSA) subassembly. The MSA and a silicon substrate are flip-bonded together. The MSA has a new back side fabrication process to actuate the microshutters electrostatically, and the new silicon substrate has light shields. The microshutters with a pixel size of 100 x 200 sq micrometers are fabricated on silicon with thin silicon nitride membranes. The microshutters rotate 90 deg on torsion bars. The selected microshutters are actuated, held, and addressed electrostatically by applying voltages on the electrodes the front and back sides of the microshutters. The substrate has the light shield to block lights around the microshutters. Also, electrical connections are made from the MSA to a controller board via the substrate.

Description: The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices.