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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 3074-3081 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The experimental transient behavior of Si metal-oxide-semiconductor transistors (MOSTs) operated at liquid-helium temperatures in the prekink, clockwise hysteresis regime is described in detail. As is shown, the drain current exhibits a pronounced decay, after switching on the device, both in n- and pMOSTs. The effective "exponential'' time constant τ of the transient is in the order of seconds to hundreds of seconds and is a strong function of the gate, the drain, and the substrate biases. Generally, a strong reduction of τ with increasing drain current is observed. These findings are critically discussed in view of the dominant dopant ionization mechanisms at 4.2 K. It is demonstrated that the reported drain current dependence of the transient time constant can be interpreted by considering shallow-level impact ionization by the channel carriers. It is furthermore demonstrated that the anomalous transients occasionally observed point to the occurrence of the reverse process, namely capture of free carriers. By considering these two mechanisms, a comprehensive model for the prekink hysteresis behavior is established.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 1416-1422 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In this paper, the drain voltage dependence of the low-frequency (lf) noise of partially depleted silicon-on-insulator n-metal-oxide-semiconductor-transistors (n-MOSTs) is investigated in detail at liquid helium temperature. As will be shown, an increase in the noise spectral density is observed at the kink position, similar to bulk n-MOSTs operated at 4.2 K. This excess noise introduces a Lorentzian generation-recombination (GR) component in the lf noise spectrum. The physical mechanism underlying the GR noise is thought to be the same as for bulk transistors: ionization and capture in the depletion region of carriers, which are created at the drain. This generates a fluctuation in the depletion charge, which is translated into a fluctuation of the drain current via a change in the threshold voltage. A model will be proposed that is derived from the analysis previously established for the bulk case. Extension of the model to fully depleted, thin-film transistors and to higher temperatures (77 K, 300 K) will be briefly outlined. As will be demonstrated, a good overall agreement between theory and experiment is obtained whereby the key features of the noise overshoot, i.e., its position and amplitude, are consistently reproduced.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 3068-3073 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The experimental hysteresis behavior of Si metal-oxide-semiconductor transistors (MOSTs) operated at liquid-helium temperatures (LHT) is described in detail. It is demonstrated that two different hysteresis regimes can be distinguished: a kink-related counterclockwise and a prekink clockwise regime. The difference in hysteresis sense is related to the different physical mechanisms underlying the phenomena. It is demonstrated that there exists a strong relationship between the hysteresis and the transient behavior of a Si MOST at 4.2 K. The possible transient mechanisms, e.g., self-heating or dopant ionization, are critically reviewed. The transient results presented are in line with the field-assisted ionization of the frozen-out dopant atoms in the Si substrate. For the counterclockwise hysteresis regime an improved analysis is presented, which is based on the original forced depletion layer formation approach. In the companion article the transient behavior in the prekink, clockwise regime is described in detail and discussed in view of the different possible dopant ionization mechanisms at LHT.
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 70 (1991), S. 1016-1024 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In this paper, the forward current-voltage (I-V) characteristics of Si p-n junction diodes, fabricated in different state-of-the-art complementary-metal-oxide-semiconductor (CMOS) technologies, are investigated at liquid helium temperatures. As will be shown, three different I-V regimes can exist: a forward breakdown/hysteresis regime at a turn-on voltage which may be larger than the built-in potential of the junction; a thermionic emission regime, corresponding to a I=A exp(qV/kT) relation and a high-injection space-charge-limited regime, giving rise to a current which is proportional to Vn. The anomalous turn-on behavior can be explained by considering the small barrier for carrier injection, which exists at the "ohmic'' contact. It will be demonstrated that the presence of this forward breakdown is strongly determined by the fabrication technology used. In extreme cases (large-area well diodes) multiple breakdown is observed, indicating an inhomogeneous, filamentary current flow. As will be shown, similar breakdown behavior is observed in more complex junction-based Si devices at 4.2 K; the consequences for deep-cryogenic CMOS circuitry will be briefly addressed.
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 4091-4099 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A simple, one-dimensional model describing the steady-state charge transport in a silicon n+nn+ (p+pp+) resistor at liquid-helium temperatures is derived. This model includes both space-charge and (contact) barrier limitations to the current flow, typically occurring at these temperatures (T〈30 K) in Si. Furthermore, account is made for the interactions between the injected free carriers and the shallow doping atoms, i.e., mainly trapping and shallow level impact ionization, yielding breakdown of the material at rather low electrical fields F. Good qualitative agreement with measured current-voltage characteristics is found. In addition, the model is able to describe the flow of avalanche-generated current through the substrate/well of a metal-oxide-semiconductor transistor, which is essential for developing a truly analytical description of the low-temperature drain current kink.
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 77 (1995), S. 910-914 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effects of the substrate bias VBS on the parameters of random telegraph signals (RTSs) in submicrometer silicon p-channel metal–oxide–semiconductor transistors are analyzed. The fractional RTS amplitude increases slightly for more positive VBS, suggesting a close connection with the capture cross section of the corresponding near-interface oxide trap. A strong exponential dependence of the capture time constant on the drain current ID is observed, which can be explained by the transverse-field dependence of the hole capture cross section. The emission time constant on the other shows only a weak dependence on VBS, or ID. Finally, the corresponding low-frequency noise peaks at constant frequency f are studied in detail; excellent agreement is observed between the theoretical Lorentzian spectrum and the experimental peaks. © 1995 American Institute of Physics.
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 77 (1995), S. 5669-5676 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The electrical activity of extended lattice defects formed by interstitial oxygen precipitation in silicon is studied. Their impact on diode characteristics and on minority carrier lifetime is addressed for different initial oxygen contents and pretreatments. The carrier traps present in the substrate are studied with deep level transient spectroscopy and with photoluminescence spectroscopy. The obtained electrical results are correlated with those of structural and chemical characterization using cross-section transmission electron microscopy and Fourier transform infrared spectroscopy. © 1995 American Institute of Physics.
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 3647-3653 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Possible physical mechanisms for random telegraph signal (RTS) -like fluctuations in the front-channel drain current of a silicon-on-insulator (SOI) metal-oxide-semiconductor (MOS) transistor are discussed. Particular emphasis is on two RTS mechanisms which are believed to be typical for a SOI MOS transistor. The first one is related to carrier trapping in the Si film, by a deep-level trap in the depletion region. As such, this type of RTS is more or less complementary to the standard behavior, which is caused by carrier trapping through a near-interface oxide trap. Second, it is demonstrated experimentally that by varying the back-gate bias of a thin-film SOI MOS transistor "new'' RTSs may be detected.
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  • 9
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 72 (1998), S. 1054-1056 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: An accurate method for the extraction of the reverse diffusion current component in a silicon p-n junction diode is proposed. It combines capacitance–voltage and current–voltage measurements on an array of diodes with different geometry in order to separate the peripheral and the volume leakage current components. The corrected volume capacitance is then used to calculate the depletion width as a function of the reverse bias. Extrapolation of the reverse current to zero depletion width results in the diffusion current part, both for the volume and for the peripheral component. From the temperature dependence, a thermal activation energy of 1.12 eV is obtained. The volume diffusion current density of the p-type Czochralski wafers studied, shows a pronounced substrate dependence, while the peripheral diffusion current density is constant. Finally, the implications for the extraction of the effective bulk recombination lifetime are discussed. © 1998 American Institute of Physics.
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 68 (1996), S. 788-790 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of high energy particle irradiation on the low-frequency (LF) noise behavior of forward biased Czochralski (Cz) silicon p-n junction diodes is reported. It is shown that in the near-ideal diode region, the LF noise is hardly affected by up to 2×1011 cm−2 MeV proton (H+) and by up to 1015cm−2 MeV electron (e−) irradiations, respectively, and is therefore resistent to both bulk and ionization radiation damage. At higher injection levels, where the forward current and LF noise are series resistance dominated, a clear increase of the noise can be observed due to the high energy particle irradiation, which mainly creates displacement damage in the bulk of the wafer. The same noise observations hold for 60Co γ-irradiated Cz n+p diodes, which were performed for comparison purposes. In the latter case, the main degradation source is ionization damage in the peripheral lateral oxide isolation regions, as shown by reverse current and gated diode measurements. © 1996 American Institute of Physics.
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