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Interaction of a growing crack with the boundary in a bicrystal (1973)

Guz', I. S. ; Demina, G. S. ; Levius, A. M. ; [et al.]

Springer

Journal of applied mechanics and technical physics 14 (1973), S. 553-557

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ISSN: 1573-8620

Source: Springer Online Journal Archives 1860-2000

Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics

Notes: Abstract Dynamic photoelasticity has been used in conjunction with selective etching on lithium fluoride bicrystals to examine the interaction of a growing crack with inclined boundaries; it is found that the stresses at the head of the crack alter as the boundary is approached. The speed of the crack is related to the angle of incidence on the boundary and the angular disorientation of the latter. The change in crack speed is related to the change in state of stress at the vertex. Analytical and experimental distributions are presented for the stresses ahead of a growing crack.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1007/BF01201249

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