Publication Date:
2018-08-04
Description:
Materials, Vol. 11, Pages 1348: Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating Materials doi: 10.3390/ma11081348 Authors: Chang-Chun Liu Jin Cheng Xiao-Qiang Li Zhi-Jie Gu Kenji Ogino The generation of a flexible printed circuit board on polymer fabrics has been a challenge over the last decade. In this work, a copper pattern was obtained on a soft substrate of filter paper/polyacrylonitrile (FP/PAN) film, where the filter paper was commercially available. The pattern of Ag particles was first produced on an Ag+-doped FP/PAN composite film, followed by electroless plating of copper using the metal silver particles as seeds. The in situ reduction of silver particles and the formation of the silver agglomeration pattern were induced by laser irradiation technology on the FP/PAN/AgNO3 composite film. A variety of characterizations indicated that the resultant copper deposition was uniform, with good conductivity properties.
Electronic ISSN:
1996-1944
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
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