Publication Date:
2019-06-28
Description:
The feasibility of utilizing air lay and liquid lay felt deposition techniques to fabricate strain isolation pad (SIP) materials for the Space Shuttle Orbiter was demonstrated. These materials were developed as candidate replacements for the present needled felt SIP used between the ceramic tiles and the aluminum skin on the undersurface of the Orbiter. The SIP materials that were developed consisted of high temperature aramid fibers deposited by controlled fluid (air or liquid) carriers to form low density unbonded felts. The deposited felts were then bonded at the fiber intersections with a small amount of high temperature polyimide resin. This type of bonded felt construction can potentially eliminate two of the problems associated with the present SIP, viz., transmittal of localized stresses into the tiles and load history dependent mechanical response. However, further work is needed to achieve adequate through thickness tensile strength in the bonded felts.
Keywords:
NONMETALLIC MATERIALS
Type:
NASA-CR-166599
,
NAS 1.26:166599
Format:
application/pdf
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