ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The growth and morphology of the intermetallic compounds (IMC) formed at theinterface between the solder ( Sn–3.5Ag–0.5Cu ) and the Cu substrate of the lead - free solder jointhave been investigated by means of isothermal aging at 125°C. The scalloped Cu6Sn5 intermetalliccompound layer was formed at the interface between the solder and Cu substrate upon reflow. Thethickness of Cu6Sn5 layer increased with aging time. Cu3Sn appeared between Cu6Sn5 layer and Cusubstrate when isothermally aged for 100 hours. Compare to Cu6Sn5 , the thickness of Cu3Sn wasrather low, and nearly did not increase with aging time.In this paper, the comparison was made among the Sn-Pb and the Sn-Ag-Cu(SAC) solders whichwere pre-treated differently before soldering
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.561-565.2115.pdf
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