ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract The thermal expansion coefficient of silica prepared by means of low-pressure plasma-induced chemical vapour deposition has been investigated in the temperature range 20 to 750° C. Undoped, fluorine-doped (up to 5wt%), germanium-doped (up to 14 wt%), as well as F/GeO2-codoped samples were measured and compared to NBS standard silica samples. Fluorine-doped silica shows a lower thermal expansion coefficient than the NBS standard. A surprising hysteresis effect in the measured expansion curves was found. Its concentration dependence and annealing is discussed.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01111918
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