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  • 1
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    A systems approach to solder joint fatigue in spacecraft electronic packaging (1991)
    In:  Other Sources
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    Publication Date: 2011-08-24
    Description: Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.
    Keywords: QUALITY ASSURANCE AND RELIABILITY
    Type: ASME, Transactions, Journal of Electronic Packaging (ISSN 1043-7398); p. 121-128.
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  • 2
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    Calorimetric thermal-vacuum performance characterization of the BAe 80 K space cryocooler (1992)
    In:  Other Sources
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    Publication Date: 2011-08-24
    Description: A comprehensive characterization program is underway at JPL to generate test data on long-life, miniature Stirling-cycle cryocoolers for space application. The key focus of this paper is on the thermal performance of the British Aerospace (BAe) 80 K split-Stirling-cycle cryocooler as measured in a unique calorimetric thermal-vacuum test chamber that accurately simulates the heat-transfer interfaces of space. Two separate cooling fluid loops provide precise individual control of the compressor and displacer heatsink temperatures. In addition, heatflow transducers enable calorimetric measurements of the heat rejected separately by the compressor and displacer. Cooler thermal performance has been mapped for coldtip temperatures ranging from below 45 K to above 150 K, for heatsink temperatures ranging from 280 K to 320 K, and for a wide variety of operational variables including compressor-displacer phase, compressor-displacer stroke, drive frequency, and piston-displacer dc offset.
    Keywords: ENGINEERING (GENERAL)
    Type: In: IECEC '92; Proceedings of the 27th Intersociety Energy Conversion Engineering Conference, San Diego, CA, Aug. 3-7, 1992. Vol. 5 (A93-25851 09-44); p. 5.101-5.107.
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  • 3
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    Vibration characterization and control of miniature Stirling-cycle cryocoolers for space application (1991)
    In:  Other Sources
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    Publication Date: 2011-08-24
    Description: This paper provides a summary overview of the vibration characteristics of split Stirling cryocoolers of the Oxford type and describes means being developed to achieve vibration levels consistent with the exacting requirements of sensitive infrared spectrometer instruments currently under development for NASA applications. A key emphasis of the paper is on exploring both active and passive means of reducing the residual upper harmonics of the drive frequency that remain with nulled back-to-back compressor and displacer units. Vibration supression results, measured with JPL's unique six-DOF force dynamometer, are presented for an 80 K Stirling cooler.
    Keywords: ENGINEERING (GENERAL)
    Type: In: Advances in cryogenic engineering. Vol. 37B - Proceedings of the 1991 Cryogenic Engineering Conference, Univ. of Alabama, Huntsville, June 11-14, 1991 (A93-48578 20-37); p. 1019-1027.
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  • 4
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    Cold-tip off-state conduction loss of miniature Stirling cycle cryocoolers (1991)
    In:  Other Sources
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    Publication Date: 2011-08-24
    Description: For redundant miniature Stirling-cycle cryocoolers in space applications, the off-state heat conduction down the coldfinger of one cooler is a parasitic heat load on the other coolers. At JPL, a heat flow transducer specifically designed to measure this load has been developed, and measurements have been performed on the coldfinger of a British Aerospace 80 K Stirling cooler with the tip temperature ranging between 40 and 170 K. Measurements have also been made using a transient warmup technique, where the warmup rates of the coldtip under various applied heat loads are used to determine the static conduction load. There is a difference between the results of these two methods, and these differences are discussed with regard to the applicability of the transient warmup method to a nonoperating coldfinger.
    Keywords: ENGINEERING (GENERAL)
    Type: In: Advances in cryogenic engineering. Vol. 37B - Proceedings of the 1991 Cryogenic Engineering Conference, Univ. of Alabama, Huntsville, June 11-14, 1991 (A93-48578 20-37); p. 1037-1043.
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  • 5
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    Requirements for long-life mechanical cryocoolers for space applications (1990)
    In:  Other Sources
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    Publication Date: 2011-08-19
    Description: The growing demand for long wavelength infrared and submillimeter imaging instruments for space observational applications, together with the emergence of the multiyear life Oxford University Stirling cycle cooler, has led to a rapidly expanding near term commitment to mechanical cryocoolers throughout the subkelvin to 150 K temperature range for long-life space missions. To satisfy this growing commitment, emerging cryocoolers must successfully address not only the input power, cooling power, and mass constraints of the spacecraft and instruments, but also the broad array of complex interface requirements that critically affect successful integration to the sensitive instrument detectors. Generic requirements are presented for each of the cryocooler requirement areas, which are then contrasted with the projected capabilities of emerging space cryocoolers. The degree of match is used to highlight both the strengths of existing technologies and the areas in need of increased development.
    Keywords: ENGINEERING (GENERAL)
    Type: Cryogenics (ISSN 0011-2275); 30; 233-238
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  • 6
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    Effects of temperature and moisture on module leakage currents (1985)
    In:  Other Sources
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    Publication Date: 2011-08-19
    Description: Experimental and analytical results are presented that characterize the rate dependency of leakage currents on environmental temperature and humidity level and quantify the influence of module construction features such as rear-surface films and foils, cell-frame gap spacings, and encapsulant resistivity and thickness. The relative roles of surface and bulk resistivity are illuminated together with their differing dependencies on surface moisture, bulk moisture, and temperature.
    Keywords: ELECTRONICS AND ELECTRICAL ENGINEERING
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  • 7
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    The block program approach to photovoltaic module development (1985)
    In:  Other Sources
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    Publication Date: 2011-08-19
    Description: A series of photovoltaic module development activities, designated Blocks I through V, used increasingly refined requirements together with extensive testing and failure analysis to assist industry in developing the most advanced modules possible. The block program approach is described and the design details are given for all modules developed, highlighting the blockwise improvements. The success of this approach is demonstrated by the fact that most design details of the Block V modules have been adopted internationally. Instrumental to this success have been the steady improvements in design and test specifications that have guided module development. The experience gained since development of the Block-V specification is being incorporated into a Block VI Design and Test Specification, which includes upgraded and revised application-specific requirements. Highlights of this Block VI specification are also described.
    Keywords: ENERGY PRODUCTION AND CONVERSION
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  • 8
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    Candidate materials for advanced fire-resistant photovoltaic modules (1985)
    In:  Other Sources
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    Publication Date: 2011-08-19
    Description: A cooperative, cost-sharing research effort to develop a technology base required to construct fire-ratable photovoltaic modules has resulted in the identification of several high-temperature, back-surface candidate materials capable of raising the fire-resistance of modules using hydrocarbon encapsulants to Class A and B levels. Advanced experimental module configurations have been developed using back surfaces consisting of Kapton, Tedlar laminates, metal-foils, and fiberglass materials with high-temperature coatings. Test results (October 1984; March 1985; May 1985; and October 1985) indicate that several of these advanced module configurations are capable of achieving Class B fire-resistance levels, while a few configurations can achieve Class A levels. The paper summarizes activities to date, discussing flammability failure mechanisms, time-temperature profiles, and results of Block V environmental exposure tests of a candidate material suitable for both Class B and Class A fire-resistance levels.
    Keywords: ENERGY PRODUCTION AND CONVERSION
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  • 9
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    Electrochemical degradation of amorphous-silicon photovoltaic modules (1985)
    In:  Other Sources
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    Publication Date: 2011-08-19
    Description: Techniques of module electrochemical corrosion research, developed during reliability studies of crystalline-silicon modules (C-Si), have been applied to this new investigation into amorphous-silicon (a-Si) module reliability. Amorphous-Si cells, encapsulated in the polymers polyvinyl butyral (PVB) and ethylene vinyl acetate (EVA), were exposed for more than 1200 hours in a controlled 85 C/85 percent RH environment, with a constant 500 volts applied between the cells and an aluminum frame. Plotting power output reduction versus charge transferred reveals that about 50 percent a-Si cell failures can be expected with the passage of 0.1 to 1.0 Coulomb/cm of cell-frame edge length; this threshold is somewhat less than that determined for C-Si modules.
    Keywords: ENERGY PRODUCTION AND CONVERSION
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  • 10
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    Design solutions for the solar cell interconnect fatigue fracture problem (1982)
    In:  Other Sources
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    Publication Date: 2011-08-18
    Description: Mechanical fatigue of solar cell interconnects is a major failure mechanism in photovoltaic arrays. A comprehensive approach to the reliability design of interconnects, together with extensive design data for the fatigue properties of copper interconnects, has been published. This paper extends the previous work, developing failure prediction (fatigue) data for additional interconnect material choices, including aluminum and a variety of copper-Invar and copper-steel claddings. An improved global fatigue function is used to model the probability-of-failure statistics of each material as a function of level and number of cycles of applied strain. Life-cycle economic analyses are used to evaluate the relative merits of each material choce. The copper-Invar clad composites demonstrate superior performance over pure copper. Aluminum results are disappointing.
    Keywords: ENERGY PRODUCTION AND CONVERSION
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