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  • 1
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Silicided p+n junctions and contact resistivity test structures were formed by implantation of BF2 through TiSi2 in crystalline as well as in Si+ or Ge+ preamorphized silicon. A subsequent rapid thermal annealing at 950 °C in nitrogen atmosphere was performed to activate the dopant, to remove the ion implantation damage, to increase the silicide conductivity, and to improve the electrical characteristics of the junction. Very low leakage currents and low contact resistivities were measured on samples without preamorphization. With Si+ or Ge+ implantation the channeling of boron was suppressed but residual defects below the original amorphous-crystalline (a-c) interface gave rise to an increased leakage current. A Ti-related defect level was found by deep level transient spectroscopy in the silicon substrate up to a depth of some micrometers.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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  • 2
    Digitale Medien
    Digitale Medien
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 815-817 
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Rapid thermal annealing of Ti/Si couples has been investigated by transmission electron microscopy using cross-section preparation, four-point probe measurement of sheet resistance, and Auger electron spectroscopy. The development of crystalline phases was determined in this way with high spatial and temporal resolution. Our results indicate the decisive influence of the solubility of oxygen on the phase sequence.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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  • 3
    Digitale Medien
    Digitale Medien
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 3162-3167 
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Boron was implanted with four energies and doses at 400 °C into 6H–SiC epilayers to form a 500 nm thick doped layer with a mean concentration between 1×1018 and 1.5×1021 cm−3. Two annealing techniques were used: furnace and flash lamp annealing. The electrical and microstructural effects were investigated using temperature dependent Hall measurements, cross sectional electron microscopy, and secondary ion mass spectrometry. During the annealing two competing processes occurred: boron outdiffusion and growth of boron containing precipitates. The efficiency of these individual processes is different for varying dopant concentrations as well as annealing techniques. After furnace annealing at temperatures between 1550 and 1750 °C and for a mean boron concentration of 5×1019 cm−3 boron containing clusters are found mainly around the region of the three deeper implantation peaks. In the surface region boron outdiffusion is observed adjusting a concentration of 1.5×1019 cm−3. Using flash lamp annealing, the outdiffusion is negligible. For high dopant concentrations (1.5×1021 cm−3) the growth of random distributed boron precipitates is the dominating effect independent of the used annealing techniques. The electrical activation is limited due to the solubility of boron in SiC. After furnace annealing Hall effect measurements show a maximum hole concentration of about 2×1016 cm−3 for the boron concentration of about 5×1018 cm−3. Alternative to the furnace annealing, the electrical properties after flash lamp annealing at about 2000 °C, 20 ms show a slight enhancement of the maximum hole concentration for boron concentrations 〈3×1020 cm−3. © 2001 American Institute of Physics.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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  • 4
    Digitale Medien
    Digitale Medien
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 6934-6936 
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Strong gettering of Cu atoms beyond the projected ion range RP has been found in single-crystal Si implanted with P+ and As+ ions at MeV energies. We call this phenomenon the "trans-RP effect." The formation of a separate Cu gettering band below RP, as detected by secondary ion mass spectrometry, indicates the presence of a significant amount of defects therein. These defects have not been detected by transmission electron microscopy and we suggest that they are small interstitial clusters. The amount of Cu atoms gettered beyond RP is, particularly for the P implants, much greater than that in the gettering layer at RP, indicating that the gettering ability of the point defects beyond RP is higher than that of the extended defects at RP. A mechanism responsible for their formation and clustering in the trans-RP region is proposed, and an explanation is given of the differences in the results for the P and As implants. © 2000 American Institute of Physics.
    Materialart: Digitale Medien
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  • 5
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Five different species, namely B, Si, P, Ge, and As, were implanted at MeV energies into (100)-oriented n-type Czohralski Si, in order to form deep gettering layers during the subsequent annealing. Then the samples were contaminated with Cu by implanting the impurity on the backface and performing additional annealing. The resulting Cu depth distributions were measured by secondary ion mass spectrometry. Strong gettering of Cu atoms beyond the projected ion range RP and formation of a well-defined separate Cu gettering band therein is found for P and As implants. We call this phenomenon the "trans-RP effect." It arises from the presence of a significant amount of defects in the regions much deeper than RP. Their gettering ability is higher than that of the extended defects around RP, as the amount of Cu atoms gettered beyond RP is, especially for the P implants, much greater than that in the implanted gettering layer at RP. These deep defects have not been detected by transmission electron microscopy, and we suggest that they are small interstitial clusters. A mechanism responsible for the migration of self-interstitials from RP into the trans-RP region and their clustering therein is proposed. An explanation is given of the possible reasons for the differences in the results for the P+ and As+ implants. © 2000 American Institute of Physics.
    Materialart: Digitale Medien
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  • 6
    Digitale Medien
    Digitale Medien
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 74 (1999), S. 979-981 
    ISSN: 1077-3118
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Flash-lamp annealing was used for activation and crystal recovery of highly aluminum-implanted 6H-SiC wafers. In comparison with conventional furnace annealing, the free hole concentration can be remarkably increased at high acceptor atom concentrations (≥5×1020 cm−3). The lowest resistivity measured at room temperature was 0.01 Ω cm. In this case, the layers are characterized by metallic conduction with weak dependence of the hole concentration on the temperature. This effect is caused by freezing-in of the enhanced solubility of aluminum in SiC at the extraordinary high temperature of about 2000 °C during the light-flash. © 1999 American Institute of Physics.
    Materialart: Digitale Medien
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  • 7
    Digitale Medien
    Digitale Medien
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 75 (1999), S. 3467-3469 
    ISSN: 1077-3118
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Deep gettering layers have been formed in Si wafers by MeV implantation of Si+ and P+ ions, followed by annealing. Samples have been subsequently contaminated with Cu. Secondary ion mass spectrometry analysis reveals for P implants gettering of Cu atoms in regions significantly deeper than the projected ion range RP and formation of a separate Cu gettering band there. We call this phenomenon the "trans-RP effect." The results obtained indicate the presence of an appreciable amount of defects in the region beyond RP. Their gettering ability is much higher than that of the implanted gettering layer at RP. The size of these deep defects is below the resolution limit of transmission electron microscopy. We suggest that they are interstitials and/or small interstitial clusters. An explanation of the mechanism responsible for their migration from RP into the trans-RP region and their clustering is proposed. © 1999 American Institute of Physics.
    Materialart: Digitale Medien
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  • 8
    Digitale Medien
    Digitale Medien
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 81 (2002), S. 70-72 
    ISSN: 1077-3118
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Low-resistivity (〈0.1 Ω cm), p-type SiC layers of about 500 nm width and targeted acceptor concentrations of 1.5×1020 cm−3 and 5.0×1020 cm−3 were produced by the combination of high-dose (1.0 and 3.3×1016 cm−2), multienergy (50–450 keV) Al+ ion implantation of 6H-SiC at −130 °C, ion-beam-induced crystallization with 500 keV, 5×1015 Si+ cm−2 at 500 °C and subsequent furnace annealing at 1500 °C for 10 min. The implanted SiC layers have a nanocrystalline structure consisting of randomly oriented grains of mainly 3C-SiC. The electrical properties of the doped, nanocrystalline layers were investigated by sheet resistance and Hall measurements in dependence on temperature and compared with results from single-crystalline reference samples. In comparison with the standard doping process, the hole concentration at 50 °C is enhanced by more than one order of magnitude from 9.0×1017 cm−3 to 1.6×1019 cm−3 in the case of 1.5×1020 Al cm−3 and from 6.1×1018 cm−3 to 8.0×1019 cm−3 in the case of 5.0×1020 Al cm−3, respectively. It can be speculated that the loss of active Al acceptors by precipitation is reduced in the nanocrystalline layers and, therefore, the critical concentration for the formation of an impurity band can be achieved. © 2002 American Institute of Physics.
    Materialart: Digitale Medien
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  • 9
    Digitale Medien
    Digitale Medien
    Amsterdam : Elsevier
    Nuclear Inst. and Methods in Physics Research, B 19-20 (1987), S. 492-495 
    ISSN: 0168-583X
    Quelle: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Thema: Physik
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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  • 10
    Digitale Medien
    Digitale Medien
    Amsterdam : Elsevier
    Nuclear Inst. and Methods in Physics Research, B 74 (1993), S. 213-217 
    ISSN: 0168-583X
    Quelle: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Thema: Physik
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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