ALBERT

Description: Pixel technology is commonly used in the tracking systems of High Energy Physics detectors with physical areas that have largely increased in the last decades. To ease the production of several square meters of sensitive area, the possibility of using the industrial Wafer Level Packaging to reassemble good single sensor tiles from multiple wafers into a reconstructed full wafer is investigated. This process reconstructs wafers by compression molding using silicon charged epoxy resin. We tested high glass transition temperature low-stress epoxy resins filled with silica particles to best match the thermal expansion of the silicon die. These resins are developed and characterized for industrial processes, designed specifically for fan-out wafer-level package and panel-level packaging. In order to be compatible with wafer processing during the hybridization of the pixel detectors, such as the bump-bonding, the reconstructed wafer must respect challenging technical requirements. Wafer planarity, tile positioning accuracy, and overall thickness are amongst the main ones. In this paper the description of the process is given and preliminary results on a few reconstructed wafers using dummy tiles are reported. Strategies for Wafer Level Packaging improvements are discussed together with future applications to 3D sensors or CMOS pixel detectors.

Description: Terrestrial Laser Scanner (TLS) is an active instrument widely used for physical surface acquisition and data modeling. TLS provides both the geometry and the intensity information of scanned objects depending on their physical and chemical properties. The intensity data can be used to discriminate different materials, since intensity is proportional, among other parameters, to the reflectance of the target at the specific wavelength of the laser beam. This article focuses on the TLS-based recognition of rocks in simple sedimentary successions mainly constituted by limestones and marls. In particular, a series of experiments with an Optech ILRIS 3D TLS was carried out to verify the feasibility of this application, as well as to solve problems in data acquisition protocol and data processing. Results indicate that a TLS intensity-based discrimination can provide reliable information about the clay content of rocks in clean outcrop conditions if the geometrical aspects of the acquisition (i.e. distance) are taken into account. Reflectance values of limestones, marls and clays show, both in controlled conditions and in the field, clear differences due to the interaction of the laser beam (having a 1535 nm wavelength) with H2O- bearing minerals and materials. Information about lithology can be therefore obtained also from real outcrops, at least if simple alternation of limestones and marls are considered. Comparison between reflectance values derived from TLS acquisition of an outcrop and the clay abundance curves obtained by gas chromatography on rock samples taken from the same stratigraphic section shows that reflectance is linked by an inverse linear relationship (correlation coefficient r = −0.85) to the abundance of clay minerals in the rocks. Reflectance series obtained from TLS data are proposed as a tool to evaluate the variation of clay content along a stratigraphic section. The possibility of linking reflectance values to lithological parameters (i.e. clay content) could provide a tool for lithological mapping of outcrops, with possible applications in various fields, ranging from petroleum geology to environmental engineering, stratigraphy and sedimentology.

Description: Published

Description: 522-528

Description: 7A. Geofisica per il monitoraggio ambientale

Description: JCR Journal