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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of thermal analysis and calorimetry 46 (1996), S. 1511-1525 
    ISSN: 1572-8943
    Keywords: characterization ; epoxy ; extended cure time
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract Five epoxy resins of different chemistry and functionality were cured with DDS (4,4′-diaminodiphenyl sulfone) using 2, 8 and 14 h curecycles. Both Differential Scanning Calorimetry (DSC) and Thermomechanical Analysis (TMA) were used to characterize reaction behavior and cured properties of the resin systems. In addition, static mechanical tests and density measurements were integrated with the thermal characterization methods to correlate resin properties with process time. Flexural three-point bending experiments showed that the resins tended to have higher yield stress and toughness values at extended cure times. The improved mechanical properties could be attributed to the full development of the epoxy molecular structure, in the form of cross-linked networks and molecular rearrangement. These results suggest that extended cure times or high temperature post-curing may be required to obtain the resin's ultimate mechanical properties for high performance composites.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Journal of thermal analysis and calorimetry 54 (1998), S. 501-519 
    ISSN: 1572-8943
    Keywords: complex heat capacity ; heat transfer ; phase lag ; TMDSC
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract In the present study, a complete model of thermal diffusion in a TMDSC specimen is presented. The governing equation takes into account thermal conductivity and does not neglect temperature gradients. This model is solved analytically for a specimen of cylindrical geometry with two surfaces following the block temperature and considering the third surface insulated. The full analytical solution consists of a transient and an asymptotic expression. The asymptotic expression is divided into an underlying and a cyclic part to allow comparison with existing models. The present model finds that the phase angle between the temperatures of sample and block are dependent upon the sample material, which has not been predicted by existing models. Moreover, the present model does not require the use of an experimentally determined constant as long as the cell is ideal. It was found that the phase lag between sample and block temperatures could be described by two effective thermal diffusivities, Λ′ and Λ″, instead of complex heat capacities $$c'_p {\text{ and }}c''_{\text{p}} $$ and $$c'_p {\text{ and }}c''_{\text{p}} $$ . These heat capacity parameters were viewed as mathematical artifacts arising from the use of an over-simplified governing equation that does not take into account thermal conductivity and thermal gradients within the specimen.
    Type of Medium: Electronic Resource
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