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  • diffusion  (1)
  • thin films  (1)
  • 1
    ISSN: 1573-2746
    Schlagwort(e): grain boundary migration ; diffusion ; triple junctions ; misfit dislocations ; transmission electron microscopy
    Quelle: Springer Online Journal Archives 1860-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: Abstract Diffusion-induced grain boundary migration (DIGM) is studied by the transmission electron microscopy method in polycrystalline two-layer Pd/Ag thin films with a grain size (100–2000 nm). In addition to the typical features of DIGM known for coarse-grained bulk objects and foils, new features are found which are caused by a quite dense network of triple junctions and by misfit dislocations: fast increase of grain boundary curvature and inclination; back motion of grain boundaries owing to recrystallization forces and termination of DIGM. Homogenization resulted from diffusion-induced migration of misfit dislocations is observed in addition to DIGM.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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  • 2
    Digitale Medien
    Digitale Medien
    Springer
    Interface science 2 (1995), S. 247-259 
    ISSN: 1573-2746
    Schlagwort(e): interphase boundaries ; misfit dislocations ; interdiffusion ; vacancy flows ; thin films
    Quelle: Springer Online Journal Archives 1860-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: Abstract Interdiffusion processes in epitaxial single-crystal Pd/Ag thin films within the temperature range 20°–500°C are studied by transmission electron microscopy, electron diffraction and electrical resistance methods. Homogenization is investigated both during deposition and during annealing. The mass transfer kinetics is found to depend significantly on the original structure of the interphase boundary (dislocations present or not) and on its reconstruction due to interdiffusion. Regular networks of misfit dislocations at the interface can retard interdiffusion, while network failures lead to acceleration of homogenization process. The vacancy flows play a decisive role in these processes. The effects of interphase dislocations on the DIGM, DIR and RID processes are discussed. The numerical study of electrical resistance variations during annealing is carried out. The concentration profiles are plotted for a nontrivial dependence of interdiffusion coefficient on concentration. The numerical results are compared with the experimental data.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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