Publication Date:
2024-04-11
Description:
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc.
Keywords:
TA1-2040
;
T1-995
;
micromachining
;
n/a
;
turbulent kinetic energy dissipation rate
;
microelectromechanical systems (MEMS) piezoresistive sensor chip
;
WiFi-RSSI radio map
;
step detection
;
built-in self-test
;
regularity of activity
;
motion analysis
;
gait analysis
;
frequency
;
acceleration
;
MEMS accelerometer
;
zero-velocity update
;
rehabilitation assessment
;
vacuum microelectronic
;
dance classification
;
Kerr noise
;
MEMS
;
micro machining
;
MEMS sensors
;
stereo visual-inertial odometry
;
self-coaching
;
miniaturization
;
wavelet packet
;
three-axis acceleration sensor
;
MEMS-IMU accelerometer
;
performance characterization
;
electrostatic stiffness
;
delaying mechanism
;
three-axis accelerometer
;
angular-rate sensing
;
indoor positioning
;
whispering-gallery-mode
;
sensitivity
;
heat convection
;
multi-axis sensing
;
L-shaped beam
;
stride length estimation
;
activity monitoring
;
process optimization
;
mismatch of parasitic capacitance
;
electromechanical delta-sigma
;
cathode tips array
;
in situ self-testing
;
high acceleration sensor
;
deep learning
;
marine environmental monitoring
;
accelerometer
;
fault tolerant
;
hostile environment
;
micro-electro-mechanical systems (MEMS)
;
low-temperature co-fired ceramic (LTCC)
;
classification of horse gaits
;
Taguchi method
;
interface ASIC
;
capacitive transduction
;
digital resonator
;
safety and arming system
;
inertial sensors
;
MEMS technology
;
sleep time duration detection
;
field emission
;
probe
;
piezoresistive effect
;
capacitive accelerometer
;
auto-encoder
;
MEMS-IMU
;
body sensor network
;
optical microresonator
;
wireless
;
hybrid integrated
;
mode splitting
;
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
Language:
English
Format:
image/jpeg
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