Publication Date:
2019-07-13
Description:
Fracture of Czochralski silicon wafers during processing is an important factor in solar cell yield and cost. A fracture-mechanics test and analysis program was developed to evaluate fracture strength changes in the in-process wafer-to-cell processing at different stages on a manufacturer's production line. The strength data were described by Weibull statistical analysis and can be interpreted with the surface-flaw distribution of each of the process steps.
Keywords:
STRUCTURAL MECHANICS
Type:
Photovoltaic Specialists Conference; Jan 07, 1980 - Jan 10, 1980; San Diego, CA
Format:
text
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