ISSN:
0021-8995
Keywords:
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
A new apparatus is described whereby the thermal behavior, including the deformation temperature, of a thermoplastic material may be obtained. The apparatus is intended to replace ASTM procedure No. D648-56 and has several advantages over that procedure. Thermal behavior of several common thermoplastics under two different stresses and for three different heating rates is described. An application to the determination of optimum cure times for certain thermosetting epoxides is also described.
Additional Material:
5 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/app.1973.070170511
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