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  • 1
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    Silicon Micromachining for Terahertz Component Development (2013)
    In:  Other Sources
    Details
    Publication Date: 2019-07-13
    Description: Waveguide component technology at terahertz frequencies has come of age in recent years. Essential components such as ortho-mode transducers (OMT), quadrature hybrids, filters, and others for high performance system development were either impossible to build or too difficult to fabricate with traditional machining techniques. With micromachining of silicon wafers coated with sputtered gold it is now possible to fabricate and test these waveguide components. Using a highly optimized Deep Reactive Ion Etching (DRIE) process, we are now able to fabricate silicon micromachined waveguide structures working beyond 1 THz. In this paper, we describe in detail our approach of design, fabrication, and measurement of silicon micromachined waveguide components and report the results of a 1 THz canonical E-plane filter.
    Keywords: Mechanical Engineering
    Type: 2013 IEEE MTT-S International Microwave and RF Conference; Dec 14, 2013 - Dec 16, 2013; New Delhi; India
    Format: text
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  • 2
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    Wafer-To-Wafer Alignment Method (2018)
    In:  CASI
    Details
    Publication Date: 2019-08-26
    Description: A silicon alignment pin is used to align successive layer of component made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.
    Keywords: Mechanical Engineering
    Format: application/pdf
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