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  • Composites  (2)
  • ELECTRONICS AND ELECTRICAL ENGINEERING  (1)
  • 1
    ISSN: 1572-8935
    Keywords: Fatigue behavior ; AS-4/PEEK ; Composites ; Weibull distribution function ; Tension-tension ; Surface temperature change
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract Fatigue behavior of carbon fiber reinforced poly etheretherketone (PEEK) laminated composite was investigated. The [±45]4s AS-4/PEEK laminated composites under static tensile measurement at various test temperatures were conducted. Three tension-tension fatigue loading frequencies, 1 Hz, 5 Hz and 10 Hz, were selected to study the effect of frequency on the fatigue behavior of [±45]4s AS-4/PEEK laminate. The survival probability of experimental fatigue life data under different stress amplitude tests were estimated and analyzed by the median rank order-statistic cumulative-distribution function and the Weibull distribution function. The S-N curves at different fatigue loading frequencies exhibited a trend of two-segment straight line curves. The increase in surface temperature of specimens was found and the thermal stress history was also investigated by thermo-image techniques during fatigue life testing. The fatigue failure mechanism was investigated by X-ray radiography.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1572-8935
    Keywords: Fatigue behavior ; C.F./PEEK ; Composites ; Weibull distribution function ; Hygrothermal ; Impact
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract The hygrothermal effects on the fatigue behavior of the Carbon/PEEK laminated composites before and after impact damage were examined in this study. The [0/45/90/-45]2s AS-4/PEEK laminated composites were immersed in 80°C hot water for 45, 90 and 200 days,and subjected to falling weight impact with an energy of 8.58 J and then immersed in 80°C hot water for 45 days. It was found that the tensile strength of AS-4/PEEK laminated composites decreased with the increase of exposure period. The injured AS-4/PEEK composites were subjected to a static load and a tensiontension fatigue load at various levels of stress amplitudes. The effect of stress amplitude on the fatigue life was studied. The experimental fatigue life under different stress amplitude tests were estimated by the median rank order statistic cumulative distribution function. Then,the fitting curves for estimated data were analyzed by the Weibull distribution function. The S-N curves for a series of cyclic loads at various survival probabilities were presented. The damage behaviors of composites after fatigue load test were also investigated by scanning electron microscope(SEM). Results indicated the fatigue lives of immersed specimens were shorter than those without hygrothermal effect, the impact damage affects the fatigue life of composite significantly.
    Type of Medium: Electronic Resource
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  • 3
    Publication Date: 2019-07-13
    Description: A monolithic 10 x 10 two-dimensional array of 'optical neuron' optoelectronic threshold elements for neural network applications has been designed, fabricated, and tested. Overall array dimensions are 5 x 5 mm, while the individual neurons, composed of an LED that is driven by a double-heterojunction bipolar transistor, are 250 x 250 microns. The overall integrated structure exhibited semiconductor-controlled rectifier characteristics, with a breakover voltage of 75 V and a reverse-breakdown voltage of 60 V; this is attributable to the parasitic p-n-p transistor which exists as a result of the sharing of the same n-AlGaAs collector between the transistors and the LED.
    Keywords: ELECTRONICS AND ELECTRICAL ENGINEERING
    Type: Laser Diode Technology and Applications Meeting; Jan 18, 1989 - Jan 20, 1989; Los Angeles, CA; United States
    Format: text
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