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  • Chemistry  (3)
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  • 1
    Electronic Resource
    Electronic Resource
    Assessment of residual stresses during cure and cooling of epoxy resins (1995)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 35 (1995), S. 1895-1898 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A new stress monitoring technique, a stress-tracking device, is described here. It has been used to study some important properties of epoxy resin. Residual stresses, including a curing shrinkage stress and a cooling shrinkage stress, were measured automatically and continuously during curing and cooling. Simultaneously, information such as an apparent gelation time and glass transition temperature were obtained directly during the experiment. These epoxy resin properties were related to the extent of cure. Varying cure temperature produced changes of cure behavior, which resulted in different residual stresses.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760352309
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  • 2
    Electronic Resource
    Electronic Resource
    A study of the residual microstress at the matrix interface in filled epoxy resins (1992)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 32 (1992), S. 678-685 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Using the technique of photoelasticity, we have studied in detail the magnitude of the residual microstress at the matrix interface between epoxy resin and rubber particles or glass beads. A spheric stress-optic equation applicable to these composites was derived. The photoelastic figures induced by the interfacial residual microstresses and the factors affecting the intensity of light are discussed. The experimental results show that the residual microstresses at the matrix interface are independent of the particle size of rubbers or glass beads, but depend on the nature of fillers, which have different thermal expansion coefficients and mechanical properties. Thermal history and interfacial chemical bonding of filled epoxy resins have distinct effects on the residual interfacial microstresses and the matrix internal stresses.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760321006
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  • 3
    Electronic Resource
    Electronic Resource
    Kinetics and mechanism of zinc(II), cadmium(II), and mercury(II) incorporation into meso tetrameta-tolueneporphyrin (1998)
    New York, NY : Wiley-Blackwell
    International Journal of Chemical Kinetics 30 (1998), S. 277-283 
    Details
    ISSN: 0538-8066
    Keywords: Chemistry ; Physical Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: The kinetics of Zn(II), Cd(II), and Hg(II) incorporation into meso tetrameta-tolueneporphyri n (H2T(m-CH3)PP) in acetone have been studied by means of stopped-flow method. A unified reaction mechanism was proposed and the kinetic parameters were obtained by nonlinear least-square methods. The effect of ionic strength (I) on Cd(II)/H2T(m-CH3)PP was investigated. It has been found that there is a negative kinetic salt effect and the relationship of rate constants with ionic strength was obtained. Some solvent effects have also been investigated in this article. © 1998 John Wiley & Sons, Inc. Int J Chem Kinet 30: 277-283, 1998.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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