ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Ion beam mixing was used to improve the adhesion between deposited Cu film (400 Å) and polyimide (PI) substrate. Ar+ ion with the energy levels between 180 and 200 keV, and the dose between 1014 to 4 × 1016 ions/cm2 were used. The surface analyses were carried out by Rutherford Backscattering Spectroscopy (SEM). RBS analysis, using 2 MeV He+ ions, showed mixing of Cu and FI and the mixing depended on the Ar+ energy and dose. The X-ray study showed a very broad halo for deposited Cu film but the (111) peak appeared after the Ar+ implantation and the peak increased with Ar+ ion dose. Optical micrographs showed that Cu film formed circular bubbles after many thermal cycles when adhesion was poor and fracture cracks when adhesion was good.
Additional Material:
7 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760300302
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