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  • 1
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Zeitschrift für die chemische Industrie 68 (1956), S. 523-523 
    ISSN: 0044-8249
    Keywords: Chemistry ; General Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Zeitschrift für die chemische Industrie 68 (1956), S. 680-681 
    ISSN: 0044-8249
    Keywords: Chemistry ; General Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Zeitschrift für die chemische Industrie 51 (1938), S. 354-357 
    ISSN: 0044-8249
    Keywords: Chemistry ; General Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Zeitschrift für die chemische Industrie 39 (1926), S. 63-65 
    ISSN: 0044-8249
    Keywords: Chemistry ; General Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 523-530 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The plane-strain fracture toughness of two common epoxy systems of different ductility were determined at different loading rates, according to ASTM E 399 for metallic materials. The ASTM standard was applicable, but underestimated slightly the specimen thickness required for KIc. KIc decreased with an increasing loading rate and with an increasing yield stress. The fracture surfaces were all very smooth as long as plane-strain conditions prevailed.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 513-522 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The acoustic emission behavior during tensile loading of two common epoxy systems of different ductility was investigated at different loading rates. At low threshold voltage, it was possible to register acoustic emissions before the final failure. Only very few emissions were recorded compared with the amount commonly recorded for metals and composite materials. The acoustic emissions detected were of burst-type, revealing a brittle damage accumulation process. They originated from the initiation and incremental growth of microcracks of stochastic nature. The events occurred before gross yielding and during the final “brittle” failure process. Basically no events were detected between gross yielding and the final failure during which large scale yielding, necking, and stable crack growth took place. The occurrence of events at the different loading rates was strongly influenced by the yielding behavior and fracture toughness, characterized by the yield stress σy and the plane-strain fracture toughness KIc respectively. KIc was inversely dependent on the total number of events up to gross yielding. The event distribution normalized with respect to the conditions at gross yielding was hardly affected by the loading rate.
    Additional Material: 13 Ill.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 26 (1986), S. 274-284 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The effect of ductility on fatigue behavior was studied using two DGEBA-based (diglycidyl ether of bisphenol A) epoxies: a ductile Epon 815/Versamid 140 and a brittle Epon 828/Epon Z. Failure modes were different although normalized stress-life relations were similar for both resins. Two competing failure mechanisms were identified: viscoelastic creep, and nucleation and coalescence into a main crack of microcracks. No signs of crazing or fibrillation were detected. The plastic elongation during fatigue was larger in Epon 815/Versamid 140. Fracture sources showed cracked material surrounded by a region of stable growth of the main crack. In the brittle Epon 828/Epon Z cracked material was scarce and the crack initiation region was clean, especially at high stress levels. Discontinuous crack growth bands and striations were seen in the stable crack growth regions. During unstable propagation the crack advanced at different levels joined by deep cleavage steps. Branching of the main crack occurred only in the brittle resin at the final stage of propagation.
    Additional Material: 19 Ill.
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  • 8
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 30 (1990), S. 1465-1473 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Residual stresses in composites are developed during processing due to chemical shrinkage of the resin and the thermal mismatch between the constituent materials. How these residual stresses develop during cure is not fully understood. Furthermore, to model their development during cure the effect of cure on composite mechanical properties must be understood. This study addresses such concerns. Warpage of [04/904];T cross-ply specimens was measured to monitor residual stress build-up. Fiber-dominated properties were found to increase moderately with cure extent. Matrix-dominated properties increased significantly and were highly dependent on degree of cure. The curvature development was found to be elastic and could be predicted by laminated plate theory while neglecting chemical shrinkage. Thermal strains were found to remain essentially constant with cure time.
    Additional Material: 15 Ill.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Chemie Ingenieur Technik - CIT 71 (1999), S. 930-931 
    ISSN: 0009-286X
    Keywords: Chemistry ; Industrial Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Process Engineering, Biotechnology, Nutrition Technology
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    New York, NY : Wiley-Blackwell
    Helvetica Chimica Acta 34 (1951), S. 1419-1421 
    ISSN: 0018-019X
    Keywords: Chemistry ; Organic Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Die Ionen der Alkali- und der Erdalkali-Gruppe wurden als Acetate mit einem Gemisch von Äthylalkohol-Essigsäure aufsteigend chromatographiert. Die getrennten Ionen können in unterschiedlich gefärbte Violurate übergeführt werden. Es werden die Rf-Werte für Li., Na., K., Be‥, Mg‥, Ca‥, Sr‥, Ba‥ ermittelt.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
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