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  • Chemical Engineering  (2)
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  • 1
    Electronic Resource
    Electronic Resource
    Compressed fluid technology: Application to RIE-developed resists (1987)
    Hoboken, NJ : Wiley-Blackwell
    AIChE Journal 33 (1987), S. 1585-1591 
    Details
    ISSN: 0001-1541
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Process Engineering, Biotechnology, Nutrition Technology
    Notes: A novel plasma-developed resist lithographic process is described that uses compressed CO2 to extract nonvolatile siloxane molecules from host organic polymers. The process is capable of at least 0.75 μm resolution with an X-ray sensitive guest siloxane-host polymer system. A processing window was investigated and defined to eliminate or minimize film damage during compressed fluid extraction. Polymer deformation was usually avoided by using supercritical CO2 rather than liquid CO2, provided that film thicknesses were ≤1 μm. Increased solute concentrations in the host polymer also adversely affected the quality of extracted films. An in situ capacitance process monitoring scheme was developed which indicated that film damage, when observed, was primarily caused by explosive decompression of the solvent from the host polymer.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/aic.690331002
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  • 2
    Electronic Resource
    Electronic Resource
    Oxygen plasma removal of thin polymer films (1980)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 20 (1980), S. 1087-1092 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Relative rates of polymer removal in an oxygen plasma have been measured for 40 polymer samples. The rates of removal are correlated, with structural factors which enhance or retard removal. Strong backbone bonds, aromatic and polar functional groups, and metallic atoms decrease the removal rates. Weak bonds not attached to the- polymer backbone have little affect while weak bonds attached directly to the chain or in the chain greatly accelerate removal. Chlorine present in the polymer catalyzes removal. This can be mimicked by mixtures of CF4, and O2 for which much enhanced removal rates are observed.
    Additional Material: 4 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760201610
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    Paper (German National Licenses)
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