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  • Chemical Engineering  (1)
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    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 850-855 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The unique ability of the tert-butoxycarbonyl protecting group (t-BOC) to be removed by a catalytic amount of strong acid has intensified the search towards new chemically amplified resist systems based on this chemistry. A series of new copolymers of t-BOC-styrene and sulfur dioxide have been prepared by free radical polymerization. These polysulfones function as chemical amplification positive resists for deep-UV lithography when mixed with either 2,6-dinitrobenzyl tosylate or triarylsulfonium salt acid precursors. The lithographic characteristics of 2:1 and 3:1 polysulfones have been evaluated. The new positive deep-UV photoresists are aqueous base developed and are capable of 0.5 μm resolution. Even though the photoresists containing 2,6-dinitrobenzyl tosylate are less sensitive than the onium salt formulations, they displayed greater contrast values. For example the poly(t-BOC-styrene sulfone) (2:1) 15 wt % tosylate resist formulation exhibits a sensitivity of 26 mJ/cm2 and a contrast of ∼20.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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