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  • Chemical Engineering  (4)
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  • 1
    Electronic Resource
    Electronic Resource
    Assessment of residual stresses during cure and cooling of epoxy resins (1995)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 35 (1995), S. 1895-1898 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A new stress monitoring technique, a stress-tracking device, is described here. It has been used to study some important properties of epoxy resin. Residual stresses, including a curing shrinkage stress and a cooling shrinkage stress, were measured automatically and continuously during curing and cooling. Simultaneously, information such as an apparent gelation time and glass transition temperature were obtained directly during the experiment. These epoxy resin properties were related to the extent of cure. Varying cure temperature produced changes of cure behavior, which resulted in different residual stresses.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760352309
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  • 2
    Electronic Resource
    Electronic Resource
    On the thermal behavior and mechanism of residual microstress buildup at the matrix interface in filled epoxy resinsProject supported by National Natural Science Foundation of China. (1993)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 33 (1993), S. 474-479 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: We have detailed the effects of annealing and temperature on the residual microstress at the matrix interface in rubber-filled and glass bead-filled epoxy resin systems. We found that annealing renders changes in residual microstress. The closer the annealing temperature to the glass transition temperature of the sample, the more pronounced the annealing effect on the stress. Also, we examined the interfacial residual microstress and found a linear relationship with annealing temperature. A description of the mechanism of the interfacial microstress buildup is proposed.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760330805
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  • 3
    Electronic Resource
    Electronic Resource
    A study of the residual microstress at the matrix interface in filled epoxy resins (1992)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 32 (1992), S. 678-685 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Using the technique of photoelasticity, we have studied in detail the magnitude of the residual microstress at the matrix interface between epoxy resin and rubber particles or glass beads. A spheric stress-optic equation applicable to these composites was derived. The photoelastic figures induced by the interfacial residual microstresses and the factors affecting the intensity of light are discussed. The experimental results show that the residual microstresses at the matrix interface are independent of the particle size of rubbers or glass beads, but depend on the nature of fillers, which have different thermal expansion coefficients and mechanical properties. Thermal history and interfacial chemical bonding of filled epoxy resins have distinct effects on the residual interfacial microstresses and the matrix internal stresses.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760321006
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  • 4
    Electronic Resource
    Electronic Resource
    Interfacial stress concentration and the effect of residual microstress on tensile fracture in filled epoxy resinsThis project was supported by National Natural Science Foundation of China. (1993)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 33 (1993), S. 1027-1032 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Interfacial stress concentrations in rubber-filled epoxy resin and glass bead-filled epoxy resin systems were studied by a photoelastic method. We found that the stress concentration is independent of the applied stress and the particle size, but decreases with increasing chemical bonding at the interface between rubber and matrix. For the rubber-filled system, stress concentration is present at the equator of particles, while for either the untreated or treated glass bead-filled system, it is on the two poles. The effect of interfacial residual microstress on tensile fracture was studied, and results showed that the function of residual microstress is limited as tensile elongation increases.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760331604
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