ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Photosensitive polyamic acid involving substituted 3, 5-diaminobenzamide has been developed for photopatternable polyimidesiloxanes. This precursor, formulated with photosensitizers, was used to develop fine patterns by i-line UV exposure. The curing of polyamic acid was investigated by using FTIR and physical property measurement. The cured film has a high glass transition temperature depending on the siloxane content. It is stable up to 400°C and loses some of the substituted groups on heating to 500°C. The modulus, dielectric constant, and water absorption decreased with higher siloxane content.
Additional Material:
3 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760322116
Permalink
