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  • Chemistry  (2)
  • Wiley-Blackwell  (2)
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  • Wiley-Blackwell  (2)
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  • 1
    Electronic Resource
    Electronic Resource
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part A: Polymer Chemistry 28 (1990), S. 2417-2426 
    ISSN: 0887-624X
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: The use of 1,3-di(5-[2,2,1]-bicyclohexyl-2,3-dicarboxylic anhydride)-1,1,3,3-tetramethyldisiloxane, 1, as a curing agent in the presence of typical epoxy resins with Lewis bases as catalysts produces thermosets with HDTs of 320°C. The solubility of 1 in the epoxy resin allows for the preparation of a one-component formulation. A latent catalyst was developed which employs amine complexes of cobalt bis(2,4-pentanedionate). These formulations exhibit long term storage at ambient conditions, yet cure rapidly at 180-200°C.
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 25 (1985), S. 778-781 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: This paper reports the effect of humidity and temperature on the adhesive strength of a pressure sensitive adhesive (Flexbond 150) used to bond Mylar films. It has been found that, ill general, the adhesive strength decreases significantly with an increase in temperature. The effect of humidity on the bonding strength, however, was found to be process dependent. The sample preparation conditions, e.g., press weight for the bonding and the press time, are important in determining the humidity effect. The water sorption isotherm A 24°C for the adhesive was also determined. The amount of water sorbed by the adhesive at 95 percent relative pressure was found to be less than one weight percent.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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