ISSN:
0948-1907
Keywords:
Metal-organic chemical vapor deposition
;
Y—Ba—Cu—O system
;
High-Tc superconductor films
;
Large-area growth
;
Microwave properties
;
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The great bulk of CVD effort on superconducting oxide materials has concerned MOCVD of the 93 K superconductor YBa2Cu3O7-δ. Most current work involves growth of triaxially oriented YBa2Cu3O7-δ films a few hundred nanometers in thickness on monocrystalline metal oxide substrates at 650-8500C. Optimized MOCVD processes now produce YBa2Cu3O7-δ films with crystallographic quality and electrical properties comparable to the best films prepared by physical vapor deposition techniques, and offer especially attractive opportunities for large-area growth. Nevertheless, the metal δ-diketonate precursors used in YBa2Cu3O7-δ MOCVD have limited volatility and other drawbacks, which have motivated extensive background research on barium sources in particular. Non-traditional methods for delivering precursors to the deposition zone of a reactor, such as aerosol injection and flash vaporization techniques, have also been developed in response to these problems. A diverse range of YBa2Cu3O7-δ MOCVD processes, some involving plasma- or photo-assisted deposition, are in current use. These have been optimized by largely empirical means, although thermodynamic analyses and mechanistic studies offer the prospect of controlling film deposition on a more scientific basis. Unique features of MOCVD in comparison with physical vapor deposition methods include the possibility of controlling film orientation through photochemical effects, and exploitation of the high surface mobility of adsorbed molecular precursors to grow YBa2Cu3O7-δ below 600°C. With reference to potential uses for MOCVD films, near-term applications in passive microwave devices are considered in greatest detail.
Additional Material:
17 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/cvde.19970030102
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