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  • 1
    Electronic Resource
    Electronic Resource
    Thermal conductivity and interface thermal resistance of Si film on Si substrate determined by photothermal displacement interferometry (1992)
    Springer
    Applied physics 55 (1992), S. 289-296 
    Details
    ISSN: 1432-0630
    Keywords: 81.70.Dw ; 68.60.-p
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract An in situ, noncontact, photothermal displacement interferometer for performing thermal diffusivity measurements on bulk and thin-film materials has been developed. Localized transient surface motion is generated through photothermoelastic coupling of a pulsed, heating laser beam to the sample under investigation. The maximum surface displacement is found to be linearly dependent on the laser power while the proportionality is a function of the thermal diffusivity. Both thin-film conductivity and film/substrate interface thermal resistance are derived from the measured, effective thermal conductivity by employing simple heat-flow analysis. Wedge-shaped Si films, vacuum deposited on single crystal Si wafers are studied with this technique. A sample with oxide layer removed by ion bombardment of the wafer surface prior to film deposition shows the same film conductivity as a sample film deposited on an as-cast wafer, while the uncleaned sample exhibits higher interface thermal resistance. It is found that the thin-film thermal conductivity is somewhat smaller than the bulk value. However, the existence of an interface thermal resistance, when combined with film thermal conductivity, can result in an effective thermal conductivity as low as two orders of magnitude lower than the bulk value.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00348399
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  • 2
    Electronic Resource
    Electronic Resource
    Heats of Dilution, Heat Capacities and Apparent Molal Enthalpies of Li2B4O7-Li2SO4-LiCl-H2O Systems at 298.15 K (1998)
    Springer
    Journal of thermal analysis and calorimetry 52 (1998), S. 497-504 
    Details
    ISSN: 1572-8943
    Keywords: heat capacities ; heats of dilution ; Li2B4O7-Li2SO4-LiCl-H2O systems
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract The heats of dilution and heat capacities of the Li2B4O7-Li2SO4-LiCl-H2O quaternary system and the Li2B4O7-Li2SO4-H2O and Li2B4O7-LiCl-H2O ternary systems were measured in the range of ionic strengths from 19 to 0.1 at 298.15 K. The data of the heat of dilution were extrapolated to infinite dilution by use of Debye-Hückel limiting law to obtain relative apparent molal enthalpies over the range of ionic strengths I from 19 to 0.0001.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1023/A:1010107320085
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  • 3
    Electronic Resource
    Electronic Resource
    Composition design of iron-base shape memory alloys (1999)
    Springer
    Journal of materials science 18 (1999), S. 857-858 
    Details
    ISSN: 1573-4811
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1023/A:1006692025752
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  • 4
    Electronic Resource
    Electronic Resource
    Propagation of shear bands through obstacles in atactic polystyrene (1982)
    Springer
    Journal of materials science 17 (1982), S. 652-670 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract High speed cinematography (up to 6000 frames sec−1), as well as optical and electron microscopy, was used to study the formation and propagation of thin and thick shear bands in atactic polystyrene, with and without obstacles in their paths of propagation. Three different kinds of obstacles were studied, an existing thick band, a fully recovered thick band and a region dispersed with 2 to 6 μm rubber particles (a strip of high impact polystyrene). Except for the fully recovered thick band which behaved like undeformed polystyrene, the other two obstacles effectively reduced the speed of propagation of the shear band packets and changed their mode of operation by dispersing them into thin bands and spreading them out into larger spaces. However, the original localized mode of operation resumed after the shear band packet passed through the obstacles.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00540362
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  • 5
    Electronic Resource
    Electronic Resource
    Methanol crazing of coarse shear bands in polystyrene (1983)
    Springer
    Journal of materials science 18 (1983), S. 3047-3053 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract A specimen with coarse shear bands produced at stress concentrations by compression was immersed in methanol to observe craze formation. Thin crazes were initiated at shear bands and joined together while propagating to form thick crazes. Crazes were formed only on the tension side of shear bands with the craze planes perpendicular to the shear bands. When a craze propagated through a shear band, each displaced the other at intersections. Some secondary shear bands were transformed partly into crazes resulting in about a factor of ten increase in thickness. This transformation was achieved by a tensile deformation of fibrous sheets in the shear band with simultaneous production of fine fibres.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00700787
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  • 6
    Electronic Resource
    Electronic Resource
    Latent hardening in polycrystalline copper and comparison with high density polyethylene (1986)
    Springer
    Journal of materials science 21 (1986), S. 3038-3042 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract When a parallelepiped specimen of polycrystalline copper is compressed in thex-direction (primary direction) while holding thez-dimension unchanged by a vice, the specimen is anisotropically hardened as follows: when thez-direction is subsequently compressed while holding thex-dimension unchanged the yield stress (0.2% offset) is higher than the final flow stress of the primary deformation. This is similar to latent hardening in single crystals. On the other hand, if the second compression is in they-direction instead of thez-direction, the yielding (0.2% offset) occurs at a stress less than the final flow stress of the primary deformation. Both effects are reported here together with the results of two successive compressions in two mutually perpendicular directions without any constraints in either compression. These results are compared with the earlier results of high density polyethylene.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00553334
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  • 7
    Electronic Resource
    Electronic Resource
    Reverse shearing of shear bands in polystyrene (1982)
    Springer
    Journal of materials science 17 (1982), S. 3445-3459 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Shear bands produced in polystyrene by compression can be reverse sheared by a second compression in a perpendicular direction. The net shear strain can be zero or negative. Like the forward shear, the reverse shear also produces a ridge on the surface. The height of the ridge seems to be proportional to the reverse shear strain. On the side surface the reverse shear produces a step whose height increases at an average rate of 1.17 mm sec−1 (at a crosshead speed of 1 mm sec−1), estimated by high-speed cinematography at 1000 frames sec−1. During the reverse shear the second compression experiences a yield drop whose size increases with the forward strain due to the first compression. The implications of these results are discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00752190
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  • 8
    Electronic Resource
    Electronic Resource
    Fracture of shear bands in atactic polystyrene (1981)
    Springer
    Journal of materials science 16 (1981), S. 1858-1873 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Thick shear bands in polystyrene formed by compression could cause fracture or the formation of cracks by intersecting with themselves, by relaxing after the removal of the load, by propagating all the way to the side surfaces and by subsequent tensile deformation. The microstructural mechanisms involved in all these fracture processes are discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00540634
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  • 9
    Electronic Resource
    Electronic Resource
    Recovery processes in amorphous polymers (1987)
    Springer
    Journal of materials science 22 (1987), S. 3620-3630 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The release of stored energy and the recovery of dimension and volume of cold compressed polystyrene (PS), polymethyl methacrylate (PMMA) and polycarbonate (PC) were studied. The release of stored energy has two peaks, one broad peak at 70° C (PS), 55° C (PMMA) and 85° (PC) and one sharp peak at 113° C (PS,T g = 105° C), 123° C (PMMA,T g = 117° C) and 157°C (PC,T g = 152° C). The recovery of dimension has only one peak at 114° C (PS), 124° C (PMMA) and 157° C (PC). This peak agrees very well with the second peak in the release of stored energy. The recovery of volume has a broad peak similar to the first peak in stored energy. Thus there are probably two recovery processes in these polymers: one releases energy and recovers volume belowT g and the other releases energy and recovers dimension aboveT g. These two processes are consistent with the two-stage formation mechanism of shear bands in amorphous polymers.[/p]
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01161470
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  • 10
    Electronic Resource
    Electronic Resource
    Annealing of shear bands in metallic glasses (1987)
    Springer
    Journal of materials science 22 (1987), S. 3129-3138 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Shear bands introduced into the as-quenched metallic glass alloy, MetglasR 2826 (Fe40Ni40P14B6), were etched by immersion in a solution of CUS04 and HCI. Elimination of the etchability property through isothermal annealing had an apparent activation enthalpy of 250 kJ mol−1, similar to that of stress relaxation. Direct microscopic observations indicated that the etching of shear bands may be a result of stress corrosion cracking. The electrochemical etchability of shear bands in the nickel-based alloy, BNi2 (Ni68.8Cr6.6Fe2.6B14.1Si7.9), polarized in a solution of perchloric acid and acetic acid at 12° C, could also be eliminated by thermal annealing. The loss of etchability had an apparent activation enthalpy of 580 kJ mol−1, a value indicative of more complex atomic rearrangements taking place within the deformed material. Finally, shear bands introduced into the as-received BNi2 material retained the ability to reverse shear after heat treatment at temperatures in the range of 192 to 375° C even if the electrolytic etchability was apparently diminished.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01161173
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