ISSN:
1572-9605
Keywords:
Tl-1223
;
microstructure
;
TEM
;
PIT
;
processing
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
,
Physics
Notes:
Abstract We have compared the microstructure of sintered, in-situ and melt processed Tl(Bi)-1223/Ag tapes using TEM. Melt processing of the tapes increases grain connectivity and removes amorphous phases leading to an improvement in the IC/B characteristics of the material. No long range grain alignment, which is the main requirement for improving the properties, was observed in the tapes.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1023/A:1022648905495
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