ISSN:
0144-5154
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
With the ever-decreasing size of electronic components, examinesthe use of laser soldering, particularly of fine-pitch, high valuedevices. Discusses the advantages and disadvantages of using lasers and theapplications to which they are suited. Looks at the different types of lasersand how their different wavelength of operation affects the solderingprocess. Describes an experimental laser soldering station and its ability tosolder circuit boards. Concludes that modern electronic component packagingtechnology is demanding new techniques for the interconnection of devices,and that the application of lasers to the traditional technique of solderingwill enable this tested process to be applicable to the very fine pitchdevices now being introduced.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/01445159510146978
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